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Intel

®

Celeron

®

D Processor in the 775-Land LGA Package

Thermal Design Guide

53

Order #

303730

Case Temperature Reference Methodology

10. Using the micromanipulator, install the needle near to the end of groove on top of

thermocouple. Using the X, Y & Z axes on the arm place the tip of needle on top of the
thermocouple bead. Press down until the bead is seated at the end of groove on top of the step
(see

).

Figure 26. Position Bead on Groove Step

Figure 27. Detailed Thermocouple Bead Placement

Kapton* tape

Wire section into
the groove to
prepare for final
bead placement

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Содержание Celeron D

Страница 1: ...Intel Celeron D Processor in the 775 Land LGA Package for Embedded Applications Thermal Design Guide July 2005 Order 303730 002 ...

Страница 2: ...ure changes to them The Intel Celeron D Processor in the 775 Land LGA Package for Embedded Applications may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your pr...

Страница 3: ...15 2 3 2 Heatsink Mass 15 2 3 3 Package IHS Flatness 15 2 3 4 Thermal Interface Material 16 2 3 5 Summary 16 2 4 System Thermal Solution Considerations 16 2 4 1 Improving Chassis Thermal Performance 16 3 0 Thermal Metrology 18 3 1 Characterizing Cooling Performance Requirements 18 3 1 1 Example 19 3 2 Processor Thermal Solution Performance Assessment 20 3 3 Local Ambient Temperature Measurement Gu...

Страница 4: ...46 D Case Temperature Reference Methodology 47 E Board Level PWM and Fan Speed Control Requirements 57 F Mechanical Drawings 58 G Vendor Information 64 Figures 1 Package IHS Load Areas 9 2 Processor Case Temperature Measurement Location 12 3 Example Thermal Profile 13 4 Processor Thermal Characterization Parameter Relationships 19 5 Measuring TLA Active Heatsink 21 6 Measuring TLA Passive Heatsink...

Страница 5: ...ive 56 34 ATX µATX Motherboard Keep Out Footprint Definition and Height Restrictions for Enabling Components Sheet 1 59 35 ATX µATX Motherboard Keep Out Footprint Definition and Height Restrictions for Enabling Components Sheet 2 60 36 ATX µATX Motherboard Keep Out Footprint Definition and Height Restrictions for Enabling Components Sheet 3 61 37 1U 2U Motherboard Component Keep In Definition Prim...

Страница 6: ...packaging density more transistors As operating frequencies increase and packaging size decreases the power density increases while the thermal solution space and airflow typically become more constrained or remains the same within the system The result is an increased importance on system design to ensure that thermal design requirements are met for each component including the processor in the s...

Страница 7: ...efinitions Sheet 1 of 2 Term Description TA The measured ambient temperature locally surrounding the processor The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink Also referred to as TLA TC The case temperature of the processor measured at the geometric center of the topside of the IHS TE The ambient air temperature external to ...

Страница 8: ...es FMB1 and FMB2 are sequential estimates of processor specifications over time Thermal Monitor A feature on the Intel Celeron D Processor in the 775 Land LGA Package that attempts to keep the processor s die temperature within factory specifications TCC Thermal Control Circuit Thermal Monitor uses the TCC to reduce die temperature by lowering effective processor frequency when the die temperature...

Страница 9: ...t can be found in the LGA775 Socket Mechanical Design Guide The package includes an integrated heat spreader IHS that is shown in Figure 1 for illustration only Refer to the processor datasheet for further information In case of conflict the package dimensions in the processor datasheet supercede dimensions provided in this document The primary function of the IHS is to transfer the non uniform he...

Страница 10: ... compressive load to the package during a mechanical shock event Amplification factors due to the impact force during shock must be taken into account in dynamic load calculations The total combination of dynamic and static compressive load should not exceed the processor datasheet compressive dynamic load specification during a vertical shock For example with a 0 454 kg 1 lbm heatsink an accelera...

Страница 11: ...s the heatsink in place under mechanical shock and vibration events and applies force to the heatsink base to maintain desired pressure on the thermal interface material Note that the load applied by the heatsink attach mechanism must comply with the package specifications described in the processor datasheet One of the key design parameters is the height of the top surface of the processor IHS ab...

Страница 12: ...a 37 5 mm x 37 5 mm 1 474 in x 1 474 in FCLGA4 package with a 28 7 mm x 28 7 mm 1 13 in x 1 13 in IHS top surface Techniques for measuring the case temperature are detailed in Section 3 4 2 2 2 Thermal Profile The Thermal Profile defines the maximum case temperature as a function of processor power dissipation The TDP and Maximum Case Temperature are defined as the maximum values of the thermal pr...

Страница 13: ... the maximum operating temperature for the on die thermal diode when the thermal solution fan speed is being controlled by the on die thermal diode The TCONTROL parameter defines a very specific processor operating region where the TC is not specified This parameter allows the system integrator a method to reduce the acoustic noise of the processor cooling solution while maintaining compliance to ...

Страница 14: ...the overall thermal solution performance as processor cooling requirements become stricter Thermal interface material TIM is used to fill in the gap between the IHS and the bottom surface of the heatsink and thereby improve the overall performance of the stack up IHS TIM Heatsink With extremely poor heatsink interface flatness or roughness TIM may not adequately fill the gap The TIM thermal perfor...

Страница 15: ... of the heatsink must take into account airflow considerations for fan performance for example as well as other design considerations air duct etc 2 3 2 Heatsink Mass With the need for pushing air cooling to better performance heatsink solutions tend to grow larger increase in fin surface resulting in increased weight The insertion of highly thermally conductive materials like copper to increase h...

Страница 16: ...mary considerations in heatsink design include The local ambient temperature TA at the heatsink the power being dissipated by the processor and the corresponding maximum TC These parameters are usually combined in a cooling performance parameter ΨCA case to air thermal characterization parameter More information on the definition and the use of ΨCA is given in Section 2 4 below Heatsink interface ...

Страница 17: ...d cooling are all capable of dissipating additional heat Due to their varying attributes each of these solutions may be appropriate for a particular system implementation To develop a reliable cost effective thermal solution thermal characterization and simulation should be carried out at the entire system level accounting for the thermal requirements of each component In addition acoustic noise c...

Страница 18: ...d easily modeled by a single resistance parameter like Ψ The case to local ambient thermal characterization parameter value ΨCA is used as a measure of the thermal performance of the overall thermal solution that is attached to the processor package It is defined by the following equation and measured in units of C W Equation 1 ΨCA TC TA PD Where ΨCA Case to local ambient thermal characterization ...

Страница 19: ...ink can cover a given range of processor frequencies The following provides an illustration of how one might determine the appropriate performance targets The example power and temperature numbers used here are not related to any Intel processor thermal specifications and are for illustrative purposes only Assume the datasheet TDP is 100 W and the maximum case temperature from the thermal profile ...

Страница 20: ... case temperature TA is best measured by averaging temperature measurements at multiple locations in the heatsink inlet airflow This method helps reduce error and eliminate minor spatial variations in temperature The following guidelines are meant to enable accurate determination of the localized air temperature around the processor during system thermal testing 3 3 1 Measuring Active Heatsinks It...

Страница 21: ...ent scenarios Otherwise when doing a bench top test at room temperature the fan regulation prevents the heatsink from operating at its maximum capability To characterize the heatsink capability in the worst case environment in these conditions disable the fan regulation and power the fan directly based on guidance from the fan supplier NOTE Dimensions in drawing not to scale 3 3 2 Measuring Passiv...

Страница 22: ...urements are made the thermocouples must be calibrated and the complete measurement system must be routinely checked against known standards When measuring the temperature of a surface that is at a different temperature from the surrounding local ambient air errors could be introduced in the measurements The measurement errors could be caused by poor thermal contact between the thermocouple juncti...

Страница 23: ...Monitor is available on the Celeron D processor in the 775 land LGA package It provides a thermal management approach to support the continued increases in processor frequency and performance By using a highly accurate on die temperature sensing circuit and a fast acting Thermal Control Circuit TCC the processor can rapidly initiate thermal management control The Thermal Monitor can reduce cooling...

Страница 24: ...ow the trip point PROCHOT is deasserted Assertion of the PROCHOT signal is independent of any register settings within the processor It is asserted any time the processor die temperature reaches the trip point The point where the TCC activates is set to the same temperature at which PROCHOT asserts 4 2 2 Thermal Control Circuit The TCC portion of the Thermal Monitor must be enabled for the process...

Страница 25: ...e an internal interrupt which would initiate an OEM supplied interrupt service routine Regardless of the configuration selected PROCHOT will always indicate the thermal status of the processor The power reduction mechanism of thermal monitor can also be activated manually using an on demand mode Refer to Section 4 2 4 for details on this feature 4 2 4 On Demand Mode For testing purposes the therma...

Страница 26: ...rating conditions Systems that do not meet these specifications could be subject to more frequent activation of the thermal control circuit depending upon ambient air temperature and application power profile Moreover if a system is significantly under designed there is a risk that the Thermal Monitor feature will not be capable of maintaining a safe operating temperature and the processor could s...

Страница 27: ...characteristics of the processor on die thermal diode The processor datasheet provides specifications for these parameters The trace layout recommendations between the thermal diode sensors and the processor socket should be followed as listed in the vendor datasheets Design characteristics and usage models of the thermal diode sensors should be reviewed in the datasheets available from the manufa...

Страница 28: ...ROR sensor temperature error N sensor current ratio k Boltzmann Constant q electronic charge 4 2 8 THERMTRIP Signal In the event of a catastrophic cooling failure the processor will automatically shut down when the silicon temperature has reached its operating limit At this point the system bus signal THERMTRIP goes active and power must be removed from the processor THERMTRIP activation is indepe...

Страница 29: ...ds monitoring the on die thermal diode to implement acoustic fan speed control The value of on die thermal diode temperature determines which specification must be met 4 2 9 1 On Die Thermal Diode Less than TCONTROL If the thermal solution can maintain the thermal diode temperature to less than TCONTROL then TC is not specified 4 2 9 2 On Die Thermal Diode Greater than TCONTROL If the on die therm...

Страница 30: ...e TC max and TDP are constant while ΨCA will vary according to the local ambient temperature TLA Table 4 shows an example of required thermal characterization parameters for the thermal solution at various TLAs This table uses the TC max and TDP from the processor datasheet These numbers are subject to change and in case of conflict the specifications in the processor datasheet supersede the TC ma...

Страница 31: ...o 38 C However system level thermal solution verification should be performed in the final intended use 5 3 1U Form Factor Thermal solution design for the 1U form factor is challenging Due to limited volume for the heatsink mainly in the direction of heatsink height and the available amount of airflow system designers may have to make trade offs in the system boundary condition requirements i e Fi...

Страница 32: ... in Figure 9 Based on preliminary testing this heatsink has shown to have a performance ΨCA of 0 325 C W with 18 CFM of airflow This will allow a maximum TLA of 40 C and meet the processors Thermal Profile specification as described in the processor datasheet This heatsink solution uses the Honeywell PCM45F as the Thermal Interface Material TIM The performance of the heatsink could improve with mo...

Страница 33: ... This solution requires 100 of the airflow to be ducted through the heatsink fins in order to prevent heatsink bypass It is a copper base and copper fin heatsink that is attached to the motherboard with the use of a backplate This solution is shown in Figure 11 The performance of this thermal solution at multiple airflow rates is shown in Figure 12 The performance test data shown in the chart was ...

Страница 34: ...mmended motherboard component keep out as shown in Figure 37 and Figure 38 This keep out will ensure that the processor thermal solution will not interfere with the voltage regulator components In addition to this a thermal solution design must meet the maximum component heights as specified by the 2U Thin Electronics Bay Specifications located at http www ssiforum org Figure 13 illustrates the Z ...

Страница 35: ...ons 5 5 Reference Thermal Mechanical Solution For information regarding the Intel Thermal Mechanical Reference Design thermal solution and design criteria for the ATX form factor refer to the Intel Pentium 4 Processor on 90nm Process in the 775 Land LGA Package Thermal Design Guidelines Figure 13 2U Height Restrictions ...

Страница 36: ... thermal specification Various registers and bus signals are available to monitor and control the processor thermal status A thermal solution designed to the thermal profile at the thermal design power TDP as specified in the processor datasheet can adequately cool the processor to a level where activation of the Thermal Monitor feature is either very rare or non existent Automatic thermal managem...

Страница 37: ...pressive axial force Faxial induced by the heatsink preload helps to reduce the combined joint tensile and shear stress Overall the heatsink required preload is the minimum preload needed to meet all of these requirements Mechanical shock and vibration and TIM performance and LGA775 socket protection against fatigue failure A 2 Metric for Heatsink Preload for Designs Non Compliant with Intel Refer...

Страница 38: ...2 2 d dmax d 1 d 2 2 Configurations in which the deflection is measured are defined in Table 6 To measure board deflection follow industry standard procedures such as IPC for board deflection measurement Height gauges and possibly dial gauges may also be used Table 6 Board Deflection Configuration Definitions Configuration Parameter Processor Socket load plate Heatsink Parameter Name d_ref Yes No ...

Страница 39: ...d material and board manufacturing process Check with your board vendor Clip stiffness assumed constant No creep Using Figure 15 the heatsink preload at BOL is defined to comply with d_EOL d_ref 0 15 mm depending on clip stiffness assumption Note The BOL and EOL preload and board deflection differ This is a result of the creep phenomenon The example accounts for the creep expected to occur in the ...

Страница 40: ...ssuming there is no fixture that changes board stiffness d_ref is expected to be 0 18 mm on average and be as high as 0 22 mm As a result the board should be able to deflect 0 37 mm minimum at BOL Additional deflection as high as 0 09 mm may be necessary to account for additional creep effects impacting the board clip fastener assembly As a result designs could see as much as 0 50mm total downward...

Страница 41: ...igh heatsink preload However the load required to meet the board deflection recommendation refer to Section A 2 3 with a very stiff board may lead to heatsink preloads exceeding package maximum load specification For example such a situation may occur when using a backing plate that is flush with the board in the socket area and prevents the board to bend underneath the socket A 3 Heatsink Selecti...

Страница 42: ...eight of the load cell used for the test It is necessary that the load cells protrude out of the heatsink base However this protrusion should be minimized as it will create additional load by artificially raising the heatsink base The measurement offset depends on the whole assembly stiffness i e board clip fastener etc For example the Intel RCBFH 3 Reference Heatsink Design clip and fastener asse...

Страница 43: ...heatsink significantly Figure 16 Load Cell Installation in Machined Heatsink Base Pocket Bottom View Figure 17 Load Cell Installation in Machined Heatsink Base Pocket Side View Package IHS Outline Top Surface Load Cells Heatsink Base Pocket 29 mm 1 15 Wax to maintain load cell in position during heatsink installation Height of pocket height of selected load cell Load cell protrusion Note To be opt...

Страница 44: ...the force reading at no applied load it is important to calibrate the load cells against known loads Load cells tend to drift Contact your load cell vendor for calibration tools and procedure information 5 When measuring loads under thermal stress bake for example load cell thermal capability must be checked and the test setup must integrate any hardware used along with the load cell For example t...

Страница 45: ...heatsink reworked with the load cells to the board as shown for the Intel RCBFH 3 reference heatsink example in Figure 18 and actuate attach mechanism 4 Collect continuous load cell data at 1 Hz for the duration of the test A minimum time to allow the load cell to settle is generally specified by the load vendors often three minutes The time zero reading should be taken at the end of this settling...

Страница 46: ...al interface material area do not translate to a measurable improvement in thermal performance C 9 Interface Material Performance Two factors impact the performance of the interface material between the processor and the heatsink base Thermal resistance of the material Wetting filling characteristics of the material Thermal resistance is a description of the ability of the thermal interface materi...

Страница 47: ... Test Equipment To apply the reference thermocouple attach procedure it is recommended to use the equipment or equivalent given in the table below Table 8 Definitions Term Definition TTV Thermal Test Vehicle IPA Isopropyl Alcohol DMM Digital Multi Meter IHS Integrated Heat Spreader Table 9 Supporting Test Equipment Sheet 1 of 2 Item Description Part Number Measurement and Output Microscope Olympus...

Страница 48: ... using an appropriate temperature source Wire gauge and length also should be considered as some less expensive measurement systems are heavily impacted by impedance There are numerous resources available throughout the industry to assist with implementation of proper controls for thermal measurements Note It is recommended to follow company standard procedures and wear safety items like glasses f...

Страница 49: ...r in the 775 Land LGA Package Thermal Design Guide49 Order 303730 Case Temperature Reference Methodology D 14 IHS Groove Cut a groove in the package IHS according to Figure 19 Figure 19 FC LGA4 Package Reference Groove Drawing ...

Страница 50: ...a machine shop that is capable of holding drawing specified tolerances IHS channel geometry is critical for repeatable placement of the thermocouple bead ensuring precise thermal measurements The specified dimensions minimize the impact of the groove on the IHS under the socket load A larger groove may cause the IHS to warp under the socket load such that it does not represent the performance of a...

Страница 51: ...or 40 gauge type T thermocouple 3 Straighten the wire for about 38 mm 1 inch from the bead to place it inside the channel 4 Bend the tip of the thermocouple at approximately 45 degree angle by about 0 8 mm 030 inch from the tip Figure 22 D 15 2 Thermocouple Attachment to the IHS 5 Clean groove with IPA and a lint free cloth removing all residues prior to thermocouple attachment 6 Place the thermoc...

Страница 52: ...TV under the microscope unit similar to the one used in Figure 29 to continue with process It is also recommended to use a fixture like processor tray or a plate to help holding the unit in place for the rest of the attach process 9 Press the wire down about 6mm 0 125 from the thermocouple bead using the tweezers Look in the microscope to perform this task Place a piece of Kapton tape to hold the ...

Страница 53: ...end of groove on top of thermocouple Using the X Y Z axes on the arm place the tip of needle on top of the thermocouple bead Press down until the bead is seated at the end of groove on top of the step see Figure 27 and Figure 28 Figure 26 Position Bead on Groove Step Figure 27 Detailed Thermocouple Bead Placement Kapton tape Wire section into the groove to prepare for final bead placement ...

Страница 54: ...uple conditioning step Figure 29 12 Place a small amount of Loctite 498 adhesive in the groove where the bead is installed Using a fine point device spread the adhesive in the groove around the needle the thermocouple bead and the thermocouple wires already installed in the groove during Step 5 above Be careful not to move the thermocouple bead during this step Figure 30 Figure 28 Using 3D Microma...

Страница 55: ...lf an hour It is not recommended to use any curing accelerator for this step as rapid contraction of the adhesive during curing may weaken bead attach on the IHS 2 Reconfirm electrical connectivity with DMM before removing the micromanipulator 3 Remove the 3D Arm needle by holding down the TTV unit and lifting the arm 4 Remove the Kapton tape straighten the wire in the groove so it lays flat all t...

Страница 56: ...ple wire down and fill the rest of groove with adhesive See Figure 33 Make sure the wire and insulation is entirely within the groove and below the IHS surface 7 Curing time for the rest of the adhesive in the groove can be reduced using Loctite Accelerator 7452 8 Repeat Step 5 to remove any access adhesive to ensure flat IHS for proper mechanical contact to the heatsink surface Figure 32 Removing...

Страница 57: ...tions Has external remote thermal diode measurement capability required External remote thermal diode sampling rate 4 times per second required External remote diode measurement is calibrated by the component vendor to account for the diode ideality and package series resistance as listed in the appropriate datasheet recommended Note If the fan speed controller is not calibrated with the diode ide...

Страница 58: ...e right to make changes and modifications to the design as necessary Table 10 Mechanical Drawings Drawing Description Page ATX µATX Motherboard Keep Out Footprint Definition and Height Restrictions for Enabling Components Sheet 1 59 ATX µATX Motherboard Keep Out Footprint Definition and Height Restrictions for Enabling Components Sheet 2 60 ATX µATX Motherboard Keep Out Footprint Definition and He...

Страница 59: ...n D Processor in the 775 Land LGA Package Thermal Design Guide59 Order 303730 Mechanical Drawings Figure 34 ATX µATX Motherboard Keep Out Footprint Definition and Height Restrictions for Enabling Components Sheet 1 ...

Страница 60: ...ron D Processor in the 775 Land LGA Package Thermal Design Guide Order 303730 Mechanical Drawings Figure 35 ATX µATX Motherboard Keep Out Footprint Definition and Height Restrictions for Enabling Components Sheet 2 ...

Страница 61: ...n D Processor in the 775 Land LGA Package Thermal Design Guide61 Order 303730 Mechanical Drawings Figure 36 ATX µATX Motherboard Keep Out Footprint Definition and Height Restrictions for Enabling Components Sheet 3 ...

Страница 62: ...62 Intel Celeron D Processor in the 775 Land LGA Package Thermal Design Guide Order 303730 Mechanical Drawings Figure 37 1U 2U Motherboard Component Keep In Definition Primary Side ...

Страница 63: ...Intel Celeron D Processor in the 775 Land LGA Package Thermal Design Guide63 Order 303730 Mechanical Drawings Figure 38 1U 2U Motherboard Component Keep In Definition Secondary Side ...

Страница 64: ...dors and devices are listed by Intel as a convenience to Intel s general customer base but Intel does not make any representations or warranties whatsoever regarding quality reliability functionality or compatibility of these devices This list and or these devices may be subject to change without notice Table 11 Intel Reference Component Thermal Solution Provider Supplier Part Description Part Num...

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