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Introduction

R

8

Intel

®

848P Chipset Thermal Design Guide

Term Description

T

A

The measured ambient temperature locally to the component of interest. The ambient
temperature should be measured just upstream of airflow for a passive heatsink or at the fan
inlet for an active heatsink.

T

C

The measured case temperature of a component. For processors, it is measured at the
geometric center of the integrated heat spreader (IHS). For other component types, it is
generally measured at the geometric center of the die or case.

T

C-MAX

The maximum case/die temperature with an attached heatsink. This temperature is measured
at the geometric center of the top of the package case/die.

T

C-MIN

The minimum case/die temperature with an attached heatsink. This temperature is measured
at the geometric center of the top of the package case/die.

TDP

Thermal Design Power is specified as the highest sustainable power level of most or all of the
real applications expected to be run on the given product, based on extrapolations in both
hardware and software technology over the life of the component. Thermal solutions should
be designed to dissipate this target power level.

TIM

Thermal Interface Material: thermally conductive material installed between two surfaces to
improve heat transfer and reduce interface contact resistance.

lfm

Linear Feet per Minute. Unit of airflow speed.

Ψ

CA

Case-to-ambient thermal characterization parameter (Psi). A measure of thermal solution
performance using total package power. Defined as (T

C

– T

A

) / Total Package Power. Heat

source size should always be specified for

Ψ

measurements.

WSHS

Wave Solder Heatsink. A heatsink that is installed to a motherboard via wave solder process.
Pins are fixed to the heatsink base and are held in place on the motherboard by solder. There
are no associated retention clips or retention anchors.

1.2 Reference

Documents

Document

Document Number / Location

Intel

®

848P Chipset: Intel

®

82848P Memory Controller Hub (MCH)

Datasheet

Intel

®

82801EB I/O Controller Hub 5 (ICH5) and Intel

®

82801ER I/O

Controller Hub 5 R (ICH5R) Thermal Design Guide

http://developer.intel.com/design/ch
ipsets/designex/252673.htm

Intel

®

Pentium

®

4 Processor with 512-KB L2 Cache on 0.13 Micron

Process Datasheet

http://developer.intel.com/design/pe
ntium4/datashts/298643.htm

Intel

®

Pentium

®

4 Processor with 512-KB L2 Cache on 0.13 Micron

Process Thermal Design Guidelines Design Guide

http://developer.intel.com/design/pe
ntium4/guides/252161.htm

Various System Thermal Design Suggestions

http://www.formfactors.org

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Содержание 848P

Страница 1: ...Intel 848P Chipset Thermal Design Guide For the Intel 82848P Memory Controller Hub MCH August 2003 Document Number 253662 001 R ...

Страница 2: ...THER INTELLECTUAL PROPERTY RIGHT Intel products are not intended for use in medical life saving life sustaining applications Intel may make changes to specifications and product descriptions at any time without notice The 82848P MCH may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on...

Страница 3: ...isy Chain Operation 15 3 2 2 TMTV Thermal Operation 17 3 2 2 1 Recommended Test Parameters 18 3 2 2 2 TMTV Correction Factors 18 3 3 Airflow Characterization 19 4 Reference Thermal Solution 21 4 1 Operating Environment 21 4 2 Mechanical Design Envelope 22 4 3 Thermal Solution Assembly 22 4 3 1 Alternate WSHS for Non Rotated MCH 23 4 3 2 Manufacturing with the WSHS 23 4 3 2 1 Assembly Process Setti...

Страница 4: ...5 Degree Angle Clippers 24 Figure 11 WSHS Lead Clipping Order 25 Figure 12 Example Vertical Rework Jig 26 Figure 13 WSHS Target 27 Figure 14 MCH Package Drawing 32 Figure 15 MCH Component Keep Out Restrictions 33 Figure 16 WSHS Heatsink Extrusion Drawing 34 Figure 17 WSHS Heatsink Assembly Drawing 35 Tables Table 1 Intel 82848P MCH Case Temperature Specifications 10 Table 2 Intel 82848P MCH Therma...

Страница 5: ...R Intel 848P Chipset Thermal Design Guide 5 Revision History Revision Description Date 001 Initial Release August 2003 ...

Страница 6: ...R 6 Intel 848P Chipset Thermal Design Guide This page is intentionally left blank ...

Страница 7: ...pace constraints with acoustic noise This document presents the conditions and requirements to properly design a cooling solution for systems that implement the 848P chipset Properly designed solutions provide adequate cooling to maintain the chipset MCH case temperature at or below thermal specifications This is accomplished by providing a low local ambient temperature ensuring adequate local air...

Страница 8: ...Thermal Interface Material thermally conductive material installed between two surfaces to improve heat transfer and reduce interface contact resistance lfm Linear Feet per Minute Unit of airflow speed ΨCA Case to ambient thermal characterization parameter Psi A measure of thermal solution performance using total package power Defined as TC TA Total Package Power Heat source size should always be ...

Страница 9: ...ge is shown in Figure 14 Appendix A 2 1 1 Non Grid Array Package Ball Placement The MCH package uses a balls anywhere concept Minimum ball pitch is 1 0 mm 0 039 in but ball ordering does not follow a 1mm grid Board designers should ensure correct ball placement when designing for the non grid array pattern For exact ball locations relative to the package refer to the Intel 848P Chipset Datasheet F...

Страница 10: ...s value is based on expected worst case data traffic patterns and usage of the chipset and does not represent a specific software application TDP attempts to account for expected increases in power due to variation in chipset current consumption due to silicon process variation processor speed DRAM capacitive bus loading and temperature However since these variations are subject to change the TDP ...

Страница 11: ...eases the leakage power of the device increases In general the leakage is lower for the initial silicon than it is at the end of the product s life FC BGA packages have minimal heat transfer capability into the board and therefore have minimal thermal capability without thermal solutions Intel requires that system designers plan for an attached heatsink when using the MCH Table 2 Intel 82848P MCH ...

Страница 12: ...Product Specifications R 12 Intel 848P Chipset Thermal Design Guide This page is intentionally left blank ...

Страница 13: ...ork procedure in Section 4 3 3 for guidelines on installing a WSHS modified for a zero degree attach Physical modifications to a WSHS are identical to modifications for a clip attached heatsink Sections 3 1 1 details the modifications required to measure package case temperature using both clip attached heatsinks and WSHS 3 1 1 Thermocouple Attach Methodology 1 Mill a 3 3 mm 0 13 in diameter hole ...

Страница 14: ...hodology angle_attach_1 Thermocouple Wire Die Cement Thermocouple Bead Substrate Top View Not to Scale Figure 3 Zero Degree Angle Attach Heatsink Modifications Angle_Attach_Heatsink_Mod 1 3 mm 0 05 in 0 5 mm 0 02 in Depth 3 3 mm 0 13 in Diameter 1 5 mm 0 06 in Depth Generic Heatsink Shown Not to Scale ...

Страница 15: ...board to interface with the TMTV Note that although the TMTV is designed to closely match the MCH package mechanical form and fit it is recommended that final validation be performed with actual production material The TMTV mechanical features including die size ball count etc may not reflect those of the final production package 3 2 1 TMTV Daisy Chain Operation The TMTV has alternating pins short...

Страница 16: ...Thermal Metrology R 16 Intel 848P Chipset Thermal Design Guide Figure 4 TMTV Daisy Chain Structure ...

Страница 17: ...ly in parallel The heater consists of a resistor and the polarity of the power supply connections is arbitrary The package balls to access the heater are identified in Table 4 Ball reference designations can be found in Figure 4 and Figure 5 A graphical representation of the die heater and its connections are shown in Figure 6 Table 4 TMTV Heater Connections Ball Designation Connection AK10 AM9 AL...

Страница 18: ...eter ΨCA Psi Refer to Section 3 1 for instructions on measuring TC package case temperature Figure 7 shows recommended ambient temperature measurement locations for a board in a JEDEC test configuration ΨCA is analogous to thermal resistance but is defined using total package power instead of the actual power dissipated between the package case and local ambient The TMTV die size is 8 153 mm x 8 1...

Страница 19: ... Airflow velocity should be measured using industry standard air velocity sensors Typical airflow sensor technology may include hot wire anemometers Figure 7 provides guidance for airflow velocity measurement locations These locations are for a typical JEDEC test setup and may not be compatible with chassis layouts due to the proximity of the processor to the MCH The user may have to adjust the lo...

Страница 20: ...Thermal Metrology R 20 Intel 848P Chipset Thermal Design Guide This page is intentionally left blank ...

Страница 21: ...rpendicular to the MCH heatsink face or by using a heatsink with omni directional airflow e g a radial fin or X pattern heatsink Figure 8 illustrates the fin orientation of a straight fin heatsink that provides airflow to the MCH heatsink In addition MCH board placement should ensure that the MCH heatsink is within the air exhaust area of the processor heatsink Note that heatsink orientation alone...

Страница 22: ...nsists of an extruded aluminum heatsink with four mounting pins pressed into each corner of the heatsink base A thermal interface material Chomerics T 710 is pre applied to the heatsink bottom over an area in contact with the package die A 45 degree dado cut is performed on the heatsink base to create rails to reduce the possibility of tilt when assembling the WSHS Since the rails are oriented at ...

Страница 23: ...dwell time In addition the recommended solder type is standard eutectic 63 37 Sn Pb No top hat plungers should be used to hold down the WSHS during the wave solder process since it may increase the risk of heatsink tilt For best results the WSHS should be left in a floating condition as it passes through the wave solder 4 3 2 2 Inspection Criteria After the WSHS is installed and exits the wave sol...

Страница 24: ... wicking kit Figure 10 55 Degree Angle Clippers Removal Procedure 1 Remove processor heatsink retention mechanism 2 Cut the WSHS leads using the 55 degree angle clippers To reduce potential of damaging board and components cut the leads in the order shown in Figure 11 3 Flip the board over and remove the leads using tweezers and a soldering iron with a STTC 137 tip 4 Apply flux and remove any resi...

Страница 25: ...Reference Thermal Solution R Intel 848P Chipset Thermal Design Guide 25 Figure 11 WSHS Lead Clipping Order 1 2 3 4 WSHS_lead_clip_order Heatsink Shown Is Not MCH WSHS ...

Страница 26: ...tion mechanism 2 De solder the WSHS leads using a SMTC 104 tip Use a small amount of solder to prime the tip if necessary 3 Stand the board vertically using jig Figure 12 4 Use a soldering iron with an STTC 137 tip to loosen WSHS pins and remove the heatsink Gently wiggle each lead loose while applying heat to lead 5 Apply flux and remove any residual solder from each hole 6 Inspect the board and ...

Страница 27: ...e WSHS floats on top of the MCH The WSHS should move freely If it does not float remove any residual solder that may be in the mounting holes 3 Place the WSHS target on top of the WSHS fins 4 Use the SMT rework tool to melt the TIM Use 145 grams placement force and set the bottom temperature to 220 C 428 F for 90 seconds duration 5 Cool the board to room temperature 6 Stand the board vertically us...

Страница 28: ...ach of 3 perpendicular axes i e total 18 drops Profile 50 G trapezoidal waveform 11 ms duration 4 3 m s 170 in s minimum velocity change Setup Mount sample board on test fixture Include 450 g processor heatsink Visual Electrical Check Random Vibration Duration 10 min axis 3 axes Frequency Range 5 Hz to 500 Hz Power Spectral Density PSD Profile 3 13 g RMS Visual Electrical Check Thermal Cycling 40 ...

Страница 29: ...C19335 00C852301A Taiwan Monica Chih Project Manager 886 2 29952666 Ext 131 USA Harry Lin 714 739 5797 Foxconn C19335 2ZA41 001 Malaysia Cheow Kooi Lee 604 6122122 USA Kevin Tao 714 626 1278 Note These vendors and devices are listed by Intel as a convenience to Intel s general customer base but Intel does not make any representations or warranties whatsoever regarding quality reliability functiona...

Страница 30: ...Appendix A Enabled Suppliers R 30 Intel 848P Chipset Thermal Design Guide This page is intentionally left blank ...

Страница 31: ...ide 31 Appendix B Mechanical Drawings The following table lists the mechanical drawings available in this document Drawing Name Page Number MCH Package Drawing 32 MCH Component Keep Out Restrictions 33 WSHS Heatsink Extrusion Drawing 34 WSHS Heatsink Assembly Drawing 35 ...

Страница 32: ...Appendix B Mechanical Drawings R 32 Intel 848P Chipset Thermal Design Guide Figure 14 MCH Package Drawing ...

Страница 33: ...Appendix B Mechanical Drawings R Intel 848P Chipset Thermal Design Guide 33 Figure 15 MCH Component Keep Out Restrictions ...

Страница 34: ...Appendix B Mechanical Drawings R 34 Intel 848P Chipset Thermal Design Guide Figure 16 WSHS Heatsink Extrusion Drawing ...

Страница 35: ...Appendix B Mechanical Drawings R Intel 848P Chipset Thermal Design Guide 35 Figure 17 WSHS Heatsink Assembly Drawing ...

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