Product Specifications
Thermal and Mechanical Design Guidelines
13
To ensure the package static load limit is not exceeded, the designer should
understand the post reflow package height. The following figure shows the nominal
post-reflow package height assumed for calculation of a heatsink clip preload of the
reference design. Refer to the package drawing in
Appendix B to perform a detailed
analysis.
Figure 2. Nominal Package Height
PCB
2.38 mm
Solder Ball
Top of (G)MCH
2.3
Thermal Specifications
To ensure proper operation and reliability of the GMCH, the temperature must be at or
below the maximum case temperature specified in Table 2 when operating at TDP.
System and component level thermal enhancements are required to dissipate the heat
generated and maintain the GMCH within specifications. Chapter
0 provides the
thermal metrology guidelines for case temperature measurements.
The GMCH should also operate above the minimum case temperature specification
listed in Table 2.
2.4
Thermal Design Power (TDP)
2.4.1
Definition
Thermal design power (TDP) is the estimated power dissipation of the GMCH based on
normal operating conditions including V
CC
and T
C-MAX
while executing real worst-case
power intensive applications. This value is based on expected worst-case data traffic
patterns and usage of the chipset and does not represent a specific software
application. TDP attempts to account for expected increases in power due to variation
in GMCH current consumption due to silicon process variation, processor speed, DRAM
capacitive bus loading and temperature. However, since these variations are subject
to change, the TDP cannot guarantee that all applications will not exceed the TDP
value.
The system designer must design a thermal solution for the GMCH such that it
maintains T
C
below T
C-MAX
for a sustained power level equal to TDP. Please note that
the T
C-MAX
specification is a requirement for a sustained power level equal to TDP, and
that the case temperature must be maintained at temperatures less than T
C-MAX
when
operating at power levels less than TDP. This temperature compliance is to ensure
component reliability over its useful life. The TDP value can be used for thermal design
if the thermal protection mechanisms are enabled. The GMCH incorporate a hardware-
based fail-safe mechanism to keep the product temperature in specification in the
event of unusually strenuous usage above the TDP power.
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