Product Specifications
Thermal and Mechanical Design Guidelines
11
2
Product Specifications
2.1
Package Description
The GMCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid
Array (FC-BGA) package with 1226 solder balls. The die size is currently 11.83 mm
[0.466in] x 10.52 mm [0.414in] and is subject to change. A mechanical drawing of
the package is shown in Figure 11.
2.1.1
Non-Grid Array Package Ball Placement
The GMCH package uses a “balls anywhere” concept. Minimum ball pitch is 0.8 mm
[0.031 in], but ball ordering does not follow a 0.8-mm grid. Board designers should
ensure correct ball placement when designing for the non-grid array pattern. For exact
ball locations relative to the package, contact your Intel Field Sales Representative.
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