Reference Thermal Solution
24
Thermal and Mechanical Design Guidelines
The reference thermal solution for the GMCH in a BTX chassis is shown in Figure 10.
The heatsink is aluminum extruded and uses a Z-clip for attach. The clip is secured to
the system motherboard via two solder down anchors around the GMCH. The clip
helps to provide a mechanical preload to the package via the heatsink. A thermal
interface material (Honeywell* PCM45F) is pre-applied to the heatsink bottom over an
area in contact with the package die.
Note:
To minimize solder ball joint reliability risk, the BTX Z-clip heatsink is intended to be
used with the Support Retention Mechanism (SRM) described in the
Balanced
Technology Extended (BTX) Interface Specification.
For additional information on
designing the BTX chassis to minimize solder ball joint reliability, refer to the
Balanced
Technology Extended (BTX) Chassis Design Guide.
Figure 9. ATX GMCH Heatsink - Installed on Board
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