Thermal/Mechanical Specifications and Design Guidelines
67
Sensor Based Thermal Specification Design Guidance
8.3.1
Boundary Condition Definition
Using the knowledge of the system boundary conditions (such as inlet air temperature,
acoustic requirements, cost, design for manufacturing, package and socket mechanical
specifications and chassis environmental test limits) the designer can make informed
thermal solution design decisions.
For the Intel
®
Core™ i7-2000 and i5-2000 desktop processor series (Quad Core 95W)
the thermal boundary conditions for an ATX tower system are as follows:
• T
EXTERNAL
= 35 °C. This is typical of a maximum system operating environment
• T
RISE
= 5 °C. This is typical of a chassis compliant to CAG 1.1 or TAC 2.0
• T
AMBIENT
= 40 °C (T
AMBIENT
= T
EXTERNAL
+ T
RISE
)
Based on the system boundary conditions, the designer can select a T
AMBIENT
and
CA
to use in thermal modelling. The assumption of a T
AMBIENT
has a significant impact on
the required
CA
needed to meet TTV T
CASEMAX
at TDP. A system that can deliver lower
assumed T
AMBIENT
can utilize a design with a
higher
CA
, which can have a lower cost.
shows a number of satisfactory solutions for the Intel
®
Core™ i7-2000 and
i5-2000 desktop processor series (Quad Core 95W).
Note:
If the assumed T
AMBIENT
is inappropriate for the intended system environment, the
thermal solution performance may not be sufficient to meet the product requirements.
The results may be excessive noise from fans having to operate at a speed higher than
intended. In the worst case this can lead to performance loss with excessive activation
of the Thermal Control Circuit (TCC).
Note:
If an ambient of greater than 45.1 °C is necessary based on the boundary conditions a
thermal solution with a
CA
lower than 0.29 °C/W will be required.
Figure 8-4. Example: Required
CA
for Various T
AMBIENT
Conditions
Содержание 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011
Страница 12: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Страница 36: ...Independent Loading Mechanism ILM 36 Thermal Mechanical Specifications and Design Guidelines...
Страница 62: ...PECI Interface 62 Thermal Mechanical Specifications and Design Guidelines...
Страница 88: ...ATX Reference Thermal Solution 88 Thermal Mechanical Specifications and Design Guidelines...
Страница 102: ...Boxed Processor Specifications 102 Thermal Mechanical Specifications and Design Guidelines...
Страница 118: ...Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guidelines Figure B 13 ILM Shoulder Screw...
Страница 120: ...Mechanical Drawings 120 Thermal Mechanical Specifications and Design Guidelines...
Страница 126: ...Socket Mechanical Drawings 126 Thermal Mechanical Specifications and Design Guidelines...
Страница 130: ...Package Mechanical Drawings 130 Thermal Mechanical Specifications and Design Guidelines...
