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LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications

Thermal/Mechanical Specifications and Design Guidelines

5.3

Loading Specifications

The socket will be tested against the conditions listed in

Chapter 10

with heatsink and

the ILM attached, under the loading conditions outlined in this section.

Table 5-3

provides load specifications for the LGA1155 socket with the ILM installed.

The maximum limits should not be exceeded during heatsink assembly, shipping
conditions, or standard use condition. Exceeding these limits during test may result in
component failure. The socket body should not be used as a mechanical reference or
load-bearing surface for thermal solutions.

Notes:

These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top

surface.

This is the minimum and maximum static force that can be applied by the heatsink and it’s retention

solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated

to these limits.

Loading limits are for the LGA1155 socket.

This minimum limit defines the static compressive force required to electrically seat the processor onto the

socket contacts. The minimum load is a beginning of life load.

Dynamic loading is defined as a load a 4.3 m/s [170 in/s] minimum velocity change average load

superimposed on the static load requirement.

Test condition used a heatsink mass of 500gm [1.102 lb.] with 50 g acceleration (table input) and an

assumed 2X Dynamic Acceleration Factor (DAF). The dynamic portion of this specification in the product

application can have flexibility in specific values. The ultimate product of mass times acceleration plus static

heatsink load should not exceed this limit.

The maximum BOL value and must not be exceeded at any point in the product life.

The minimum value is a beginning of life loading requirement based on load degradation over time.

The maximum removal force is the flick up removal upwards thumb force (measured at 45o), not

applicable to SMT operation for system assembly. Only the minimum removal force is applicable to vertical

removal in SMT operation for system assembly.

10. The maximum heatsink mass includes the core, extrusion, fan and fasteners. This mass limit is evaluated

using the POR heatsink attach to the PCB.

Table 5-3.

Socket & ILM Mechanical Specifications

Parameter

Min

Max

Notes

ILM static compressive load on processor IHS

311 N [70 lbf]

600 N [135 lbf]

Heatsink static compressive load

0 N [0 lbf]

222 N [50 lbf]

Total static compressive Load
(ILM plus Heatsink)

311 N [70 lbf]

822 N [185 lbf]

Dynamic Compressive Load
(with heatsink installed)

N/A

712 N [160 lbf]

Pick & Place cover insertion force

N/A

10.2 N [2.3 lbf]

Pick & Place cover removal force

2.2N [0.5 lbf]

7.56 N [1.7 lbf]

Load lever actuation force

N/A

20.9 N [4.7 lbf] in the

vertical direction
10.2 N [2.3 lbf] in the

lateral direction.

Maximum heatsink mass

N/A

500g

Содержание 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011

Страница 1: ...r 324644 002 2nd Generation Intel Core Processor Family Desktop and LGA1155 Socket Thermal Mechanical Specifications and Design Guidelines TMSDG Supporting the Intel Core i7 i5 and i3 Desktop Processo...

Страница 2: ...m The processor and Intel Series 6 Chipset and LGA1155 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characte...

Страница 3: ...Socket Body Housing 23 3 3 2 Solder Balls 23 3 3 3 Contacts 23 3 3 4 Pick and Place Cover 23 3 4 Package Installation Removal 24 3 4 1 Socket Standoffs and Package Seating Plane 25 3 5 Durability 25...

Страница 4: ...59 6 4 3 Power Plane Control 60 6 4 4 Turbo Time Parameter 60 7 PECI Interface 61 7 1 Platform Environment Control Interface PECI 61 7 1 1 Introduction 61 7 1 1 1 Fan Speed Control with Digital Therm...

Страница 5: ...essor Cooling Requirements 98 11 4 2 Variable Speed Fan 100 Figures 2 1 Processor Package Assembly Sketch 13 2 2 Package View 14 2 3 Processor Top Side Markings 16 2 4 Processor Package Lands Coordina...

Страница 6: ...Fan Speed Control Options 76 9 1 ATX Heatsink Reference Design Assembly 80 9 2 ATX KOZ 3 D Model Primary Top Side 81 9 3 RCBFH Extrusion 82 9 4 Clip for Existing Solutions to straddle LGA1155 Socket...

Страница 7: ...Series Quad Core 45W 46 6 5 Thermal Test Vehicle Thermal Profile for Intel Core i5 2000 and i3 2000 Desktop Processor Series Dual Core 35W 47 6 6 Thermal Solution Performance above TCONTROL for the I...

Страница 8: ...8 Thermal Mechanical Specifications and Design Guidelines Revision History Revision Number Description Revision Date 001 Initial release January 2011 002 Minor edits for clarity January 2011...

Страница 9: ...t Loading Mechanism ILM and back plate The reference design thermal solution heatsink for the processors and associated retention hardware The Intel Core i7 2000 i5 2000 and i3 2000 desktop processor...

Страница 10: ...ns interface with the processor at the IHS surface ILM Independent Loading Mechanism provides the force needed to seat the 1155 LGA land package onto the socket contacts PCH Platform Controller Hub Th...

Страница 11: ...ase temperature specification of the TTV at a given power level TIM Thermal Interface Material The thermally conductive compound between the heatsink and the processor case This material fills the air...

Страница 12: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...

Страница 13: ...as the mating surface for processor thermal solutions such as a heatsink Figure 2 1 shows a sketch of the processor package components and how they are assembled together Refer to Chapter 3 and Chapt...

Страница 14: ...ut dimensions 5 Reference datums 6 All drawing dimensions are in mm 2 1 2 Processor Component Keep Out Zones The processor may contain components on the substrate that define component keep out zone r...

Страница 15: ...age Handling Guidelines Table 2 2 includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate These package handling lo...

Страница 16: ...the processor Table 2 3 Processor Materials Component Material Integrated Heat Spreader IHS Nickel Plated Copper Substrate Fiber Reinforced Resin Substrate Lands Gold Plated Copper Figure 2 3 Process...

Страница 17: ...rdinates Figure 2 4 shows the bottom view of the processor package Figure 2 4 Processor Package Lands Coordinates AY AV AT AP AM AK AH AF AD AB Y V T P M K H F D B AW AU AR AN AL AJ AG AE AC AA W U N...

Страница 18: ...example only Non Operating Temperature Limit 40 C to 70 C Humidity 50 to 90 non condensing with a maximum wet bulb of 28 C Post board attach storage temperature limits are not specified for non Intel...

Страница 19: ...surface mounting on the motherboard The contacts are arranged in two opposing L shaped patterns within the grid array The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the arra...

Страница 20: ...0 9144 mm 36 mil in the x direction and 3 114 mm 122 6 mil in the y direction see Figure 3 3 This was to achieve a common package land to PCB land offset which ensures a single PCB layout for socket d...

Страница 21: ...AN AR AU AW B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY 1 3 7 5 9 11 15 13 17 19 23 21 25 27 29 2 8 4 6 10 16 12 14 18 24 20 22 26 28 30 32 15 11 14 12 13 16 17 23 19 18 22 20 21 24 25 31 27 26...

Страница 22: ...The socket is attached to the motherboard by 1155 solder balls There are no additional external methods that is screw extra solder adhesive and so on to attach the socket As indicated in Figure 3 1 th...

Страница 23: ...Ag content between 3 and 4 and a melting temperature of approximately 217 C The alloy is compatible with immersion silver ImAg and Organic Solderability Protectant OSP motherboard surface finishes and...

Страница 24: ...tion with the socket 3 4 Package Installation Removal As indicated in Figure 3 7 access is provided to facilitate manual installation and removal of the package To assist in package orientation and al...

Страница 25: ...sor insertion and removal The max chain contact resistance from Table 5 4 must be met when mated in the 1st and 20th cycles The socket Pick and Place cover must withstand 15 cycles of insertion and re...

Страница 26: ...actuation must meet or exceed SEMI S8 95 Safety Guidelines for Ergonomics Human Factors Engineering of Semiconductor Manufacturing Equipment example Table R2 7 Maximum Grip Forces The socket must be...

Страница 27: ...a T 20 Torx head fastener The Torx head fastener was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM The Torx head fastener is a...

Страница 28: ...desktop back plate and screws have been implemented For ILM back plate three levels of differentiation have been implemented Unique part numbers please refer to part numbers listed in Appendix A Desk...

Страница 29: ...32 thread shoulder screw drawing The standard fasteners can be sourced locally The design assumes this fastener has a minimum yield strength of 235 MPa Please refer to Figure B 14 for the standard 6...

Страница 30: ...herboard is aligned with the fixture 2 Install the shoulder screw in the single hole near Pin 1 of the socket Torque to a minimum and recommended 8 inch pounds but not to exceed 10 inch pounds 3 Align...

Страница 31: ...e 4 5 the shoulder screw socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to socket The result is a specific Pin 1 orientation with respect to ILM...

Страница 32: ...rent vendors The tests would include manufacturability bake and thermal cycling See Appendix A for vendor part numbers that were tested Note ILMs that are not compliant to the Intel controlled ILM dra...

Страница 33: ...to the motherboard The ILM will be offered with the ILM Cover pre assembled as well as offered as a discrete component ILM Cover features Pre assembled by the ILM vendors to the ILM load plate It wil...

Страница 34: ...motherboard After assembly the pick and place cover is removed the ILM Cover installed and the ILM mechanism closed The ILM Cover is designed to pop off if the pick and place cover is accidentally lef...

Страница 35: ...cover cannot remain in place and used in conjunction with the ILM Cover The ILM Cover is designed to interfere and pop off if the pick and place cover is unintentionally left in place The ILM cover wi...

Страница 36: ...Independent Loading Mechanism ILM 36 Thermal Mechanical Specifications and Design Guidelines...

Страница 37: ...d be derived from a the height of the socket seating plane above the motherboard after reflow given in Appendix C b the height of the package from the package seating plane to the top of the IHS and a...

Страница 38: ...atic load requirement 6 Test condition used a heatsink mass of 500gm 1 102 lb with 50 g acceleration table input and an assumed 2X Dynamic Acceleration Factor DAF The dynamic portion of this specifica...

Страница 39: ...socket Socket Average Contact Resistance EOL 19 mOhm The socket average contact resistance target is calculated from the following equation sum Ni X LLCRi sum Ni LLCRi is the chain resistance defined...

Страница 40: ...ased reliability evaluation methodology which is acceleration factor dependent A simplified process flow of this methodology can be seen in Figure 5 1 A detailed description of this methodology can be...

Страница 41: ...Selection of the appropriate fan speed is based on the relative temperature data reported by the processor s Digital Temperature Sensor DTS The DTS can be read via the Platform Environment Control In...

Страница 42: ...is not the maximum power that the processor can dissipate TDP is measured at DTS 1 TDP is achieved with the Memory configured for DDR3 1333 and 2 DIMMs per channel 6 Specified by design characterizati...

Страница 43: ...system and environmental implementation details Figure 6 1 Thermal Test Vehicle Thermal Profile for Intel Core i7 2000 and i5 2000 Desktop Processor Series Quad Core 95W Table 6 2 Thermal Test Vehicl...

Страница 44: ...tal implementation details 22 51 5 72 66 0 24 52 1 74 66 6 26 52 6 76 67 1 28 53 2 78 67 7 30 53 8 80 68 3 32 54 4 82 68 9 34 55 0 84 69 5 36 55 5 86 70 0 38 56 1 88 70 6 40 56 7 90 71 2 42 57 3 92 71...

Страница 45: ...d Core 65W and Intel Core i3 2000 Desktop Processor Series Dual Core 65W Power W TCASE_MAX C Power W TCASE_MAX C 0 44 4 34 57 3 2 45 2 36 58 1 4 45 9 38 58 8 6 46 7 40 59 6 8 47 4 42 60 4 10 48 2 44 6...

Страница 46: ...ystem and environmental implementation details Figure 6 3 Thermal Test Vehicle Thermal Profile for Intel Core i5 2000 Desktop Processor Series Quad Core 45W Table 6 4 Thermal Test Vehicle Thermal Prof...

Страница 47: ...apter 10 for system and environmental implementation details Figure 6 4 Thermal Test Vehicle Thermal Profile for Intel Core i5 2000 and i3 2000 Desktop Processor Series Dual Core 35W Table 6 5 Thermal...

Страница 48: ...600 series Dual Core 65W Table 6 8 for the Intel Core i5 2000 desktop processor series Quad Core 45W and Table 6 9 for the Intel Core i5 2000 and i3 2000 desktop processor series Dual Core 35W To get...

Страница 49: ...22 0 0 709 0 533 21 0 0 727 0 543 20 0 0 746 0 554 Table 6 6 Thermal Solution Performance above TCONTROL for the Intel Core i7 2000 and i5 2000 Desktop Processor Series Quad Core 95W Sheet 2 of 2 TAM...

Страница 50: ...ble 6 8 Thermal Solution Performance above TCONTROL for the Intel Core i5 2000 Desktop Processor Series Quad Core 45W TAMBIENT 1 CA at DTS TCONTROL 2 CA at DTS 13 48 2 0 480 0 480 47 0 0 525 0 507 46...

Страница 51: ...9 Thermal Solution Performance above TCONTROL for the Intel Core i5 2000 and i3 2000 Desktop Processor Series Dual Core 35W TAMBIENT 1 CA at DTS TCONTROL 2 CA at DTS 13 48 2 0 480 0 480 47 0 0 538 0 5...

Страница 52: ...rements should be made See Figure B 12 for drawing showing the thermocouple attach to the TTV package Note The following supplier can machine the groove and attach a thermocouple to the IHS The suppli...

Страница 53: ...S is not required to select a specific method as with previous generation processors supporting TM1 or TM2 The temperature at which Adaptive Thermal Monitor activates the Thermal Control Circuit is fa...

Страница 54: ...ter 1ms the processor is still too hot the temperature has not dropped below the TCC activation point DTS still 0 and PROCHOT is still active then a second frequency and voltage transition will take p...

Страница 55: ...mperature Once the temperature has dropped below the maximum operating temperature and the hysteresis timer has expired the TCC goes inactive and clock modulation ceases 6 2 2 3 Immediate Transition t...

Страница 56: ...r it can be driven from an external source such as a voltage regulator to activate the TCC The ability to activate the TCC via PROCHOT can provide a means for thermal protection of system components A...

Страница 57: ...nology may not be available on all SKUs 6 3 1 Intel Turbo Boost Technology Frequency The processor s rated frequency assumes that all execution cores are running an application at the Thermal Design P...

Страница 58: ...and adjust the turbo frequency to maintain the average power within limits over a thermally significant time period The package processor core and graphic core powers are estimated using architectural...

Страница 59: ...ized workload or power virus application were to result in exceeding programmed power limits the processor Thermal Control Circuitry TCC will protect the processor when properly enabled Adaptive Therm...

Страница 60: ...all usages This function is similar to the package level long duration window control 6 4 4 Turbo Time Parameter Turbo Time Parameter is a mathematical parameter units in seconds that controls the pro...

Страница 61: ...o 2 Mbps CRC check byte used to efficiently and atomically confirm accurate data delivery Synchronization at the beginning of every message minimizes device timing accuracy requirements For desktop te...

Страница 62: ...PECI Interface 62 Thermal Mechanical Specifications and Design Guidelines...

Страница 63: ...pecification that meets the following requirements Use Digital Thermal Sensor DTS for real time thermal specification compliance Single point of reference for thermal specification compliance over all...

Страница 64: ...versus Sensor Based Specification Power Sensor Based Specification DTS Temp TDP Tcontrol Ta 30 C ca 0 564 ca 0 448 Power Current Specification Case Temp TDP Tcontrol Ta 45 1 C Ta 30 C ca 0 292 Power S...

Страница 65: ...on will not require the user to apply a thermocouple to the processor package or measure processor power Note All functional compliance testing will be based on fan speed response to the reported DTS...

Страница 66: ...quired CA which means lower fan speeds and reduced acoustics from the processor thermal solution In the prior thermal specifications this region DTS values greater than TCONTROL was defined by the pro...

Страница 67: ...gner can select a TAMBIENT and CA to use in thermal modelling The assumption of a TAMBIENT has a significant impact on the required CA needed to meet TTV TCASEMAX at TDP A system that can deliver lowe...

Страница 68: ...nal step in thermal solution validation is to establish the thermal solution performance CA and acoustics as a function of fan speed This data is necessary to allow the fan speed control algorithm dev...

Страница 69: ...s RPM to achieve the necessary level of cooling DTS 1 1 provides another option to do fan speed control without the Tambient data Please refer to Section 8 4 3 for more details This chapter will discu...

Страница 70: ...g assumptions are made TAMBIENT 40 C Thermal Solution designed validated to a 40 C environment TCONTROL 20 Reference processor thermal solution RCFH7 1156 DHA A Below TCONTROL the fan speed is slowed...

Страница 71: ...lates into acoustic margin that can be used in the overall system acoustic budget In this example the following assumptions are made TAMBIENT 35 C The same Thermal Solution designed validated to a 40...

Страница 72: ...even if the assumption is a TAMBIENT 35 C This is graphically displayed in Figure 8 7 The shaded area displayed in Figure 8 7 is where DTS values are less than TCONTROL For simplicity the graph shows...

Страница 73: ...ple for a 95 TDP part the Tcase max is 72 6C and at a worst case design point of 40C local ambient this will result in CA 72 6 40 95 0 34 C W Similarly for a system with a design target of 45 C ambien...

Страница 74: ...essor_TDP 2 Example For A Chassis Trise assumption of 12 C for a 95W TDP processor CF 1 7 95W 0 018 C For Trise 10 C CA at Tcontrol Value listed in Column_2 Trise 10 CF CA 0564 12 10 0 018 0 528 C W I...

Страница 75: ...hassis that has Trise lower than 10C based on the reference thermal solution data a fan speed of 1050 RPM will give the needed CA at TCONTROL A maximum fan speed of 3150 RPM will be programmed for DTS...

Страница 76: ...s desired by other system cooling needs Notes 1 Tj is the CPU temperatuers and can be calulated from relative DTS value PECI and TjMax register Tj DTS TjMax register 8 5 System Validation System valid...

Страница 77: ...ations that are representative of the expected end user usage model and verify the following Verify fan speed response versus expectations as done using Power Thermal Utility SW Validate system bounda...

Страница 78: ...he testing performed a curve was fit to the data in the form Psi_ca a x RPM3 b x RPM2 c x RPM d where a 1 53 E 11 b 1 41 E 07 c 0 00048 d 0 925782 6 Full Speed of 3150 RPM the DHA A thermal solution d...

Страница 79: ...ting the Intel Core i7 2000 and i5 2000 desktop processor series Quad Core 95W The second is called the RCFH6 1156 DHA B which only supports the Intel Core i7 2000 and i5 2000 desktop processor series...

Страница 80: ...ATX Reference Thermal Solution 80 Thermal Mechanical Specifications and Design Guidelines Figure 9 1 ATX Heatsink Reference Design Assembly...

Страница 81: ...The reference solution requires a chassis obstruction height of at least 81 30 mm 3 20 inches measured from the top of the motherboard This allows for appropriate fan inlet airflow to ensure fan perf...

Страница 82: ...al TIM The clip does not have to provide additional load for socket solder joint protect The clip is formed from 1 6 mm carbon steel the same material as used in previous clip designs The target metal...

Страница 83: ...ting designs The machined flange height will be determined in the preliminary design review to match the IHS height for the processors when installed in the LGA1155 The final height of the flange will...

Страница 84: ...design is only intended to adapt previous thermal solutions such as the Intel RCBFH3 Reference Design to comply with the mechanical and structural requirements for the LGA1155 socket If 3rd party coo...

Страница 85: ...the Reference Clip Core shoulder traps clip in place Core shoulder traps clip in place Clip Core Fin Array Fan Clip See Detail A Core Fin Array Fan Clip See Detail A Detail A Fin Array Clip Core 1 6 m...

Страница 86: ...6 Thermal Interface Material A thermal interface material TIM provides conductivity between the IHS and heat sink The designs use Dow Corning TC 1996 The TIM application is 0 14 g which will be a nomi...

Страница 87: ...shows the orientation and position of the 1155 land LGA Package TTV die this is the same package layout as used in the 1156 land LGA Package TTV The TTV die is sized and positioned similar to the prod...

Страница 88: ...ATX Reference Thermal Solution 88 Thermal Mechanical Specifications and Design Guidelines...

Страница 89: ...arefully evaluate the completed assembly prior to use in high volume Some general recommendations are shown in Table 10 1 The Intel reference heatsinks will be tested in an assembled to the LGA1155 so...

Страница 90: ...cessor IHS No visible tilt of the heatsink with respect to the retention hardware 3 No signs of physical damage on baseboard surface due to impact of heatsink 4 No visible physical damage to the proce...

Страница 91: ...terials are not fungal growth resistant then MIL STD 810E Method 508 4 must be performed to determine material performance Material used shall not have deformation or degradation in a temperature life...

Страница 92: ...Thermal Solution Quality and Reliability Requirements 92 Thermal Mechanical Specifications and Design Guidelines...

Страница 93: ...hat manufacture baseboards for system integrators Note Unless otherwise noted all figures in this chapter are dimensioned in millimeters and inches in brackets Figure 11 1 shows a mechanical represent...

Страница 94: ...entation of the boxed processor Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling The physical space requirements and dimensions for the boxed processor with...

Страница 95: ...ssor Specifications Note Diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation Figure 11 2 Space Requirements for the Boxed Processor side...

Страница 96: ...atsink attach clip assembly to secure the processor and fan heatsink in the baseboard socket The boxed processor will ship with the heatsink attach clip assembly 11 3 Electrical Requirements 11 3 1 Fa...

Страница 97: ...ader identification and location should be documented in the platform documentation or on the system board itself Figure 11 6 shows the location of the fan power connector relative to the processor so...

Страница 98: ...erature within the specifications see Table 6 1 in chassis that provide good thermal management For the boxed processor fan heatsink to operate properly it is critical that the airflow provided to the...

Страница 99: ...ications and Design Guidelines 99 Boxed Processor Specifications Figure 11 7 Boxed Processor Fan Heatsink Airspace Keepout Requirements top view Figure 11 8 Boxed Processor Fan Heatsink Airspace Keepo...

Страница 100: ...the higher set point is reached At that point the fan speed is at its maximum As fan speed increases so does fan noise levels Systems should be designed to provide adequate air around the boxed proces...

Страница 101: ...M control signal to the 4th pin of the connector labeled as CONTROL The fan speed is based on actual processor temperature instead of internal ambient chassis temperatures If the new 4 pin active fan...

Страница 102: ...Boxed Processor Specifications 102 Thermal Mechanical Specifications and Design Guidelines...

Страница 103: ...post sales support Table A 1 Reference Heatsink Item Intel PN Delta Foxconn Nidec 2011D Heatsink Assembly RCFH7 1156 DHA A E41759 002 DTC DAA07 1A01C7T00 DHA_XA02 F90T12MS1Z7 64A01A1 2011C Heatsink A...

Страница 104: ...omponents Co Ltd Kai Chang 86 755 3366 8888 x63588 kai_chang avc com tw Delta William Bradshaw 1 510 668 5570 86 136 8623 1080 WBradshaw delta corp com Foxconn Julia Jiang 1 408 919 6178 juliaj foxcon...

Страница 105: ...igure B 2 Socket Processor ILM Keepout Zone Primary Side Top Figure B 3 Socket Processor ILM Keepout Zone Secondary Side Bottom Figure B 4 Reference Design Heatsink Assembly Figure B 5 Reference Faste...

Страница 106: ...E DO NOT SCALE DRAWING SHEET 1 OF 2 UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14 5M 1994 DIMENSIONS ARE IN MILLIMETERS THIRD ANGLE PROJECTION NOTES 1 DIME...

Страница 107: ...0 18 00 18 00 9 36 9 36 27 33 DEPARTMENT R 2200 MISSION COLLEGE BLVD P O BOX 58119 SANTA CLARA CA 95052 8119 SIZE DRAWING NUMBER REV A1 E21319_REV_L_PAE L SCALE 1 000 DO NOT SCALE DRAWING SHEET 2 OF 2...

Страница 108: ...R CPU PACKAGE ALIGNS WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP INS 2 SOCKET KEEP IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSI...

Страница 109: ...X 4 70 NO ROUTE ON ALL OTHER LAYERS COPPER PAD ON PRIMARY SIDE NON GROUNDED COPPER PAD CAN INSET MAXIMUM OF 127MM FROM THE NO ROUTE EDGE 6 00 0 05 0 03 3X NPTH 3 80 0 05 0 03 11 78 8 00 3 50 17 00 18...

Страница 110: ...Mechanical Drawings 110 Thermal Mechanical Specifications and Design Guidelines Figure B 5 Reference Design Heatsink Assembly...

Страница 111: ...Thermal Mechanical Specifications and Design Guidelines 111 Mechanical Drawings Figure B 6 Reference Fastener Sheet 1 of 4...

Страница 112: ...Mechanical Drawings 112 Thermal Mechanical Specifications and Design Guidelines Figure B 7 Reference Fastener Sheet 2 of 4...

Страница 113: ...Thermal Mechanical Specifications and Design Guidelines 113 Mechanical Drawings Figure B 8 Reference Fastener Sheet 3 of 4...

Страница 114: ...Mechanical Drawings 114 Thermal Mechanical Specifications and Design Guidelines Figure B 9 Reference Fastener Sheet 4 of 4...

Страница 115: ...2 1 333 007 A 1 60 063 NOTES 1 THIS DRAWING TO BE USED IN CONJUNTION WITH SUPPLIED 3D DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE APPLICABLE...

Страница 116: ...30 D REV DRAWING NUMBER SIZE DEPARTMENT E36830 2 01 DWG NO SHT REV R TYP 0 3 0118 7 34 289 R1 4 055 R3 1 122 43 1 3 57 141 5 3 2087 7 35 2894 2X R3 6 1417 1 65 065 135 1 06 042 2X R0 5 0197 R MIN 0 45...

Страница 117: ...L IS NICKEL PLATED COPPER 5 CUT DIRECTION ORIENTATION OF GROOVE IS AS SHOWN 6 ALL MACHINED EDGES ARE TO BE FREE OF BURRS 7 THE 0 0150 DEPTH AT THE PACKAGE CENTER IS CRITICAL 4 A 3 PROJECTION MATERIAL...

Страница 118: ...Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guidelines Figure B 13 ILM Shoulder Screw...

Страница 119: ...Thermal Mechanical Specifications and Design Guidelines 119 Mechanical Drawings Figure B 14 ILM Standard 6 32 Thread Fastener...

Страница 120: ...Mechanical Drawings 120 Thermal Mechanical Specifications and Design Guidelines...

Страница 121: ...lists the mechanical drawings included in this appendix Table C 1 Mechanical Drawing List Drawing Description Figure Number Socket Mechanical Drawing Sheet 1 of 4 Figure C 1 Socket Mechanical Drawing...

Страница 122: ...Socket Mechanical Drawings 122 Thermal Mechanical Specifications and Design Guidelines Figure C 1 Socket Mechanical Drawing Sheet 1 of 4...

Страница 123: ...Thermal Mechanical Specifications and Design Guidelines 123 Socket Mechanical Drawings Figure C 2 Socket Mechanical Drawing Sheet 2 of 4...

Страница 124: ...Socket Mechanical Drawings 124 Thermal Mechanical Specifications and Design Guidelines Figure C 3 Socket Mechanical Drawing Sheet 3 of 4...

Страница 125: ...Thermal Mechanical Specifications and Design Guidelines 125 Socket Mechanical Drawings Figure C 4 Socket Mechanical Drawing Sheet 4 of 4...

Страница 126: ...Socket Mechanical Drawings 126 Thermal Mechanical Specifications and Design Guidelines...

Страница 127: ...cal Drawings D Package Mechanical Drawings Table D 1 lists the mechanical drawings included in this appendix Table D 1 Mechanical Drawing List Drawing Description Figure Number Processor Package Drawi...

Страница 128: ...Package Mechanical Drawings 128 Thermal Mechanical Specifications and Design Guidelines Figure D 1 Processor Package Drawing Sheet 1 of 2...

Страница 129: ...Thermal Mechanical Specifications and Design Guidelines 129 Package Mechanical Drawings Figure D 2 Processor Package Drawing Sheet 2of 2...

Страница 130: ...Package Mechanical Drawings 130 Thermal Mechanical Specifications and Design Guidelines...

Страница 131: ...any representations or warranties whatsoever regarding quality reliability functionality or compatibility of these devices Customers are responsible for thermal mechanical and environmental validatio...

Страница 132: ...DO NOT SCALE DRAWING SHEET 1 OF 1 NOTES 1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE ALIGNS WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP...

Страница 133: ...Thermal Mechanical Specifications and Design Guidelines 133 Heat Sink Back Plate Drawings Figure E 2 Heat Sink Back Plate...

Страница 134: ...K SHIMADA DATE DRAWN BY 12 17 07 R AOKI DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14 5M 1994 DIMENSIONS ARE IN MILLIMETERS ALL UNTOLERANC...

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Содержание 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011

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