Thermal/Mechanical Specifications and Design Guidelines
59
Thermal Specifications
The following considerations and limitations apply to the power monitoring feature:
• Calibration applies to the processor family and is not conducted on a part-by-part
basis. Therefore, some difference between actual and reported power may be
observed.
• Power monitoring is calibrated with a variety of common, realistic workloads near
Tj_max. Workloads with power characteristic markedly different from those used
during the calibration process or lower temperatures may result in increased
differences between actual and estimated power.
• In the event an uncharacterized workload or power “virus” application were to
result in exceeding programmed power limits, the processor Thermal Control
Circuitry (TCC) will protect the processor when properly enabled. Adaptive Thermal
Monitor must be enabled for the processor to remain within specification.
Illustration of Intel Turbo Boost Technology power control is shown in the following
sections and figures. Multiple controls operate simultaneously allowing for
customization for multiple system thermal and power limitations. These controls allow
for turbo optimizations within system constraints.
6.4.2
Package Power Control
The package power control allows for customization to implement optimal turbo within
platform power delivery and package thermal solution limitations.
Figure 6-7. Package Power Control
System Thermal Response Time
Turbo Algorithm Response Time
Содержание 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011
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