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N 2010-03 

r 2009

 

Application Note AN 2010-08 

V2.0, August 2010

 
 

Edition 2010-08-10 
Published by 
Infineon Technologies AG  
59568 Warstein, Germany  
© Infineon Technologies AG 2010. 
All Rights Reserved. 

 
Attention please! 
THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE 
IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE 
REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR 
QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION 
NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON 
TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND 
(INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL 
PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN 
IN THIS APPLICATION NOTE. 

 
Information 
For further information on technology, delivery terms and conditions and prices please contact your nearest 
Infineon Technologies Office (www.infineon.com). 

 
Warnings 
Due to technical requirements components may contain dangerous substances. For information on the types 
in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components 
may only be used in life-support devices or systems with the express written approval of Infineon 
Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-
support device or system, or to affect the safety or effectiveness of that device or system. Life support 
devices or systems are intended to be implanted in the human body, or to support and/or maintain and 
sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other 
persons may be endangered. 

 
AN 2010-08 
Revision History:  date (10-08-10) V2.0, Previous Version: V1.0, November 2009 
All Pages: Used new template. , Page 4 and 5: Added Chapter ” Proposal for Designing a Driver Board” 
Page 7: Changed name of the JST connector from 

"09HVD4B-EMGF-SR" 

to 

"09HVD6B-EMGF-NR".

 

Page 9: Added comment ”IFX does not 

recommend the usage of a silicon gasket for sealing.”

 

Page 11: Changed drawing “

A design example of fluid cooling system

” 

Page 14: Updated 

Figure 10

 

 
Author: Vase Klandjevski ( IFAG ATV OPEV AE ) 
 
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Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will 
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Содержание HybridPACK 2

Страница 1: ...Application Note AN 2010 08 V2 0 August 2010 HybridPACK 2 General Information and Mounting Instruction IFAG ATV OPEV...

Страница 2: ...est Infineon Technologies Office Infineon Technologies Components may only be used in life support devices or systems with the express written approval of Infineon Technologies if a failure of such co...

Страница 3: ...ng a Driver Board onto the Module 6 4 Application of the Liquid Cooling System 9 5 Screws to Mount the Module to the Heat Sink 12 6 Mounting the Module to the Heat Sink 13 7 Connecting the Bus Bars to...

Страница 4: ...en for short times may not be exceeded as this may lead to destruction of the component Moreover this application note cannot cover every type of application and condition Hence the application note c...

Страница 5: ...N 2010 03 r 2009 Application Note AN 2010 08 V2 0 August 2010 mm 0 0 25 0 35 1 Figure 1 Proposal for designing a driver board for HybridPACK 2 module...

Страница 6: ...lf trapping screw with 3 mm diameter and 10mm length should be used for example type Delta PT 30x10 from EJOT Position of the mounting self tapping screws Position of the guidance holes 1 2 3 4 5 6 7...

Страница 7: ...o this sequence of assembly the mechanical strain to the solder points can be minimised During the entire soldering process care needs to be taken that neither a too high soldering temperature nor a t...

Страница 8: ...tructure of the auxiliary terminals Due to the specific requirements of the JST connector the auxiliary terminals have the following properties The auxiliary terminals are made of 63 IACS Internationa...

Страница 9: ...he nickel plating and mechanical deformation of the pin fin structure should be strictly avoided As shown in the figure below the pin fin array is on the module base plate to get maximum heat exchange...

Страница 10: ...eeded for mounting the HybridPACKTM 2 on the cooler The contact surface of the heat sink should not exceed the following values referenced to a length of L 100mm Surface flatness 50 m Surface roughnes...

Страница 11: ...N 2010 03 r 2009 Application Note AN 2010 08 V2 0 August 2010 Figure 7 A design example of fluid cooling system...

Страница 12: ...th the red colour This gap should be minimized as well Figure 8 Cross section view of HybridPACKTM 2 and the heat sink Within the shown area A certain distances should be minimized in order to obtain...

Страница 13: ...hread and their typical friction factors of G 0 2 0 25 G friction coefficient thread in heat sink Mmin 3Nm to Mmax 6Nm For a good thermal contact to the heat sink the following procedure is recommende...

Страница 14: ...lete combination screws These should be tightened with the recommended torque of Mmin 2 5 Nm to Mmax 5 0 Nm When selecting the screws length the layer thickness of the connected parts has to be subtra...

Страница 15: ...11 in which a bus bar is connected to the power terminals in such a way that only a low force is applied to them even during shock or vibration conditions The power terminals can withstand the force F...

Страница 16: ...3 1 class 1K2 should be assured for the recommended storage time of max 2 years Max air temperature Tmaxair 40 C Min air temperature Tminair 5 C Max relative humidity 85 Min relative humidity 5 Conden...

Страница 17: ...code which is machine readable with conventional 2D reader or scanner The readers are capable of reading low contrast marks damaged codes and even codes on severely compromised surfaces On the pictur...

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