N 2010-03
r 2009
Application Note AN 2010-08
V2.0, August 2010
8 Storage
and
Transport
Storage of the module at the temperature limitations specified in the datasheet is possible
but not recommended.
The recommended storage conditions according to IEC60721-3-1, class 1K2 should be
assured for the recommended storage time of max. 2 years.
Max. air temperature: T
maxair
=+40°C
Min. air temperature: T
minair
=+5°C
Max. relative humidity: 85%
Min. relative humidity: 5%
Condensation: not permissible
Precipitation: not permissible
Iceing: not permissible
Pre-drying of the case prior to the solder process, which is recommended for moulded
discrete components (e.g. microcontrollers, TO-cases etc.), is not required for HybridPACK™
2 modules
.