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2: M
ODULE
S
PECIFICATIONS
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C
ONTROLLER
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ANUAL
2-37
Remote I/O Master Module General Specifications
Remote I/O Master Module Function Specifications
Type No.
FC3A-SX5SM1
Power Voltage
Supplied by the CPU module
Dielectric Strength
Between power terminal on the CPU module and FG: 500V AC, 1 minute
Insulation Resistance
Between REMOTE OUT terminal and FG: 10 M
Ω
minimum (500V DC megger)
Between V.24 Inter face terminal and FG: 10 M
Ω
minimum (500V DC megger)
Internal Current Draw
Approx. 142 mA (24V DC) See Power Consumption on page 2-4.
FG Terminal
M3 screw (Tightening torque: 0.6 to 1.0 N·m)
Ground
Grounding resistance: 100
Ω
maximum
Grounding Wire
UL1015 AWG22, UL1007 AWG18
Weight (approx.)
200g
Network Protocol
INTERBUS
Transmission Speed
500 kbps
Transmission Distance
Between remote I/O master and remote bus station: 400m maximum
Between remote bus stations: 400m maximum
Remote bus total length: 12.8 km maximum
Quantity of Nodes
32 remote I/O slave stations maximum
I/O Points per Node
128 points maximum (64 inputs and 64 outputs)
Branch Levels
16 maximum (INTERBUS device levels 0 through 15)
Remote I/O Connector
D-sub 9-pin female connector on the remote I/O master module
Network Cable
INTERBUS cable
V.24 Interface Connector
D-sub 9-pin male connector on the remote I/O master module
V.24 Interface Cable
Serial straight cable
Electrostatic Discharge
Severity Level
ESD-3 (network inter face)
See page 24-11.
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