Chapter
5.
Field
replaceable
units
Microprocessor
air
baffle
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. 67
Microprocessor
and
heat
sink
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. 68
CD-ROM
drive
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. 70
Diskette
drive
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. 71
SCSI
backplane
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. 72
Non-hot
swap
power
supply
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. 73
Hot-swap
power-supply
cage
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. 75
Rear-adapter
retainer
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. 77
Front
fan
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. 78
Rear
fans
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. 80
Power/LED
switch
assembly
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. 81
Front
USB
connector
assembly
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. 83
System
board
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. 85
System
board
option
connectors
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. 85
System
board
internal
connectors
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. 86
System
board
external
connectors
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. 87
System
board
error
LEDs
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. 88
System
board
jumpers
and
switches
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. 89
Removing
the
system
board
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. 90
Top/side
cover
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. 92
Bezel-release
latch
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. 93
Handle
assembly
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. 95
The
following
information
describes
procedures
for
removing
and
installing
certain
components
inside
the
system.
Only
a
qualified
service
technician
is
authorized
to
replace
the
components
described
in
this
section.
Important:
The
field
replaceable
unit
(FRU)
procedures
are
intended
for
trained
servicers
who
are
familiar
with
IBM
xSeries
products.
See
the
parts
listing
in
“System
replaceable
units”
on
page
131
to
determine
if
the
component
being
replaced
is
a
customer
replaceable
unit
(CRU)
or
a
FRU.
Note:
Before
servicing
this
system,
read
“Installation
guidelines”
on
page
25
and
Appendix
B,
“Safety
information,”
on
page
143.
Microprocessor
air
baffle
The
microprocessor
air
baffle
is
held
in
place
by
two
tabs
that
protrude
through
slots
in
the
rear
of
the
server.
Complete
the
following
steps
to
remove
the
microprocessor
air
baffle:
1.
Open
the
microprocessor
air
baffle.
2.
At
the
rear
chassis
wall,
press
the
sides
of
the
microprocessor
air
baffle
toward
each
other
and
move
the
baffle
toward
the
front
of
the
server.
3.
Lift
the
guide
up
and
out
of
the
server.
©
Copyright
IBM
Corp.
2004
67
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