HUAWEI MU736 HSPA+ M.2 Module
Hardware Guide
Installation
Issue 05 (2014-01-14)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
70
7
Installation
7.1 About This Chapter
This chapter describes the assembly of MU736, including:
7.2 Connect MU736 to Board
Figure 7-1
Install MU736
It refers to M.2 specification.
The module will need a mechanical retention at the end of the board. The module
specifies a 5.5 mm Dia. keep out zone at the end for attaching a screw.
The module Stand-off and mounting screw also serve as part of the module Electrical
Ground path. The Stand-off should be connected directly to the ground plane on the
platform. So that when the module is mounted and the mounting screw is screwed on
to hold the module in place, this will make the electrical ground connection from the
module to the platform ground plane.
The stand-off must provide a Thermal Ground Path. The design requirements for
thermal are a material with a minimum conductivity of 50 watts per meter Kelvin and
surface area of 22 Sq mm.