ME60
Hardware Description
1 Hardware Description
Issue 01 (2018-05-07)
332
Functions and
Features
Remarks
Slot information
The board occupies one half-width flexible card slot.
Reliability and
availability
Hot swappable.
Technical Specifications
Table 1-510
Interface specifications
Attribute
Description
Optical type
supported
1.11.3 155Mbps eSFP Optical Module
1.11.4 155Mbps eSFP BIDI Optical Module
1.11.5 1Gbps Electrical Transceiver
1.11.6 1.25Gbps eSFP Optical Module
1.11.8 1.25Gbps eSFP CWDM Optical Module
1.11.7 1.25Gbps eSFP BIDI Optical Module
1.11.10 125M~2.67Gbps eSFP DWDM Optical Module
Working mode
Full-duplex
Compliant
standard
IEEE 802.3
Frame format
Ethernet_II, Ethernet_SAP and Ethernet_SN/AP
Table 1-511
Board specifications
Item
Specification
Dimensions (H x W x D)
37.2 mm x 178.7 mm x 193.3 mm (1.46 in. x 7.04 in. x 7.61
in.)
Typical power
consumption
37.0 W
Typical heat dissipation
120.0 BTU/hour
Weight
1 kg (2.2 lb)
Ambient temperature
Long terms: 0 °C to 45 °C (32°F to 113°F) Short terms:
-5 °C to 55 °C (23°F to 131°F)
Содержание ME60 Series
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