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eSpace EGW1500E Enterprise Gateway
Quick Start
6 Declaration on Hazardous Substances in Electronic
Information Products
Issue 03 (2011-12-20)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
24
1.
Mechanical part such as shell: The steel, aluminum or copper materials contain lead.
2.
Board and circuit module:
z
The PCB pad contains lead.
z
Ceramic capacitor or feedthrough capacitor or mica capacitor on the board: The ceramic chip
contains lead.
z
The resistor inside the clock oscillator is immune from lead.
z
The high temperature type solder, used for the connector inside the transformer, contains more than
85% lead.
z
The luminescence glass of chip inductor contains lead.
z
The high temperature type solder used for the transistor chip contains lead.
z
The glass of resistance layer and protection layer is immune from lead.
z
The pin and solder of the components such as the IC and power unit contain lead.
3.
Signal cables: The alloy materials such as the steel, aluminum, and copper materials
contain lead.
4.
Cable connector: For most connectors, the metal shell, terminal and pin contain lead.
5.
Power adapter: The interior contains lead.
6.
The circuit board of the auxiliary equipment contains lead. Same as point one and point
two.