HUAWEI EM770 HSPA PC Embedded Module V100R001
Product Specification
Issue 1
(2008-09-15)
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Page
29 of 68
Table 3-13
PERST# signal
Pins Name
Description
Additional
Description
Direction to
Module
22
PERST# Force a hardware reset
on the card.
H: normal or
standby.
L: Reset the
EM770.
Input
3.2.8
NC Pins
The NC pins are not internally connected in the EM770.
3.3 Power Supply and Consumption
The EM770 is supplied by 3.3 V power source, which must satisfy all requirements of
PCI Express Mini CEM specifications, such as voltage tolerance and peak and
normal current. The detailed requirements are listed in Table 3-14.
Table 3-14
Power requirements
Power
Voltage Tolerance
Peak (Maximum)
Normal (Maximum)
3.3 V
±
9%
2750 mA
1100 mA
Note:
l
In burst transmit mode of GSM/GPRS/EDGE, the peak current of the module will exceed 2
A, which will pull down the power voltage transitorily and perhaps result in the reset of the
module or host. In order to avoid this case, you can add a large bulk capacitor beside the
module on the host side.
l
To minimize the RF radiation through the PCI-E interface, you can add a 33 pF ceramic
capacitor to ground on every pin of the PCI-E on the host side except USB D+/D-.
The power consumptions of the EM770 in different scenarios are respectively listed
in Table 3-15.
Table 3-15
DC power consumption (HSPA/WCDMA/ GSM/GPRS/EDGE)
WCDMA/HSDPA data DC power consumption
Description
Band
Test Value
Units
Power(dBm)
Band I(IMT2100)
291.3
mA
10dBm Tx Power
661.3
mA
24dBm Tx Power
Band II(PCS 1900)
312.6
mA
10dBm Tx Power
723.5
mA
24dBm Tx Power
Band V(850M)
299.8
mA
10dBm Tx Power
WCDMA
645.2
mA
24dBm Tx Power
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