HUAWEI EM770 HSPA PC Embedded Module V100R001
Product Specification
Issue 1
(2008-09-15)
Huawei Confidential: This documents is Huawei Proprietary and Confidential(NDA
Required).It may not be duplicated, neither distributed externally without
prior and written permission of Huawei.
Page
64 of 68
Acronyms and Abbreviations
3G
Third Generation
3GPP
3rd Generation Partnership Project
APN
Access Point Name
ARPU
Average Revenue Per User
BSS
Base Station Subsystem
CM
Connection Management
CPU
Central Processing Unit
CS domain
Circuit Switched domain
DTM
Digital Trunk Module
EDGE
Enhanced Data Rates for GSM Evolution
EGPRS
Enhanced GPRS
FDD
Frequency Division Duplex
GERAN
GSM/EDGE Radio Access Network
GPRS
General Packet Radio Service
GSM
Global System for Mobile Communications
HSPA
High Speed Downlink Packet Access
IC
Integrated Circuit
LED
Light Emitting Diode
MAC
Medium Access Control
MexE
Mobile Execution Environment
Mini PCI Express
Mini Peripheral Component Interconnect Express
MM
Mobility Management
Modem
Modulator Demodulator
MS
Mobile Station
MSC
Mobile Switching Center
NAS
Non-Access Stratum
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