3.
Remove the heat sink
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board components each time the heat sink is removed. Replacement thermal material is included
with the heat sink, processor, and system board spare part kits. Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it.
Component replacement procedures
57
Содержание Pavilion TouchSmart 14-f000
Страница 1: ...HP Pavillion Sleekbook 14 Maintenance and Service Guide ...
Страница 4: ...iv Important Notice about Customer Self Repair Parts ...
Страница 6: ...vi Safety warning notice ...
Страница 10: ...x ...
Страница 25: ...3 Illustrated parts catalog 15 ...
Страница 27: ...Computer major components Computer major components 17 ...
Страница 53: ...6 Remove the fan 5 Reverse this procedure to install the fan Component replacement procedures 43 ...
Страница 71: ...3 Remove the speakers 3 Reverse this procedure to install the speakers Component replacement procedures 61 ...
Страница 91: ......