NOTE:
For discrete models, thoroughly clean thermal material from the surfaces of the system board
components
(1)(3)(5)
, the heat sink
(2)(4)(6)
each time you remove the heat sink. All heat sink and
processor spare part kits include thermal material.
In the following illustration, the location denoted by callout
(2)
on the heat sink uses thermal grease.
The location denoted by callout
(4)
on the heat sink uses a GPU thermal pad. The location denoted by
callout
(6)
on the heat sink uses a PCH thermal pad.
NOTE:
For UMA models, thoroughly clean thermal material from the surfaces of the system board
(1)
(3)
and heat sink
(2)(4)
each time you remove the heat sink. All heat sink and processor spare part
kits include thermal material.
In the following illustration, the location denoted by callout
(2)
on the heat sink uses thermal grease.
The location denoted by callout
(4)
on the heat sink uses a PCH thermal pad.
Component replacement procedures
91
Содержание EliteBook 8560p
Страница 1: ...HP EliteBook 8560p Notebook PC HP ProBook 6560b Notebook PC Maintenance and Service Guide ...
Страница 4: ...iv Safety warning notice ...
Страница 8: ...viii ...
Страница 35: ...Computer major components Computer major components 27 ...
Страница 43: ...Display components Display components 35 ...
Страница 100: ...Reverse this procedure to install the heat sink 92 Chapter 4 Removal and replacement procedures ...
