HP E1411A, Руководство по обслуживанию

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•
Do not use pliers to remove a MOS or CMOS device from a
high-grip socket. Instead, use a small screwdriver to pry the device
up from one end. Slowly lift the device up, one pair of pins at a time.
•
After you remove a MOS or CMOS device from an assembly, place
the device onto a pad of conductive foam or other suitable holding
material.
•
If a device requires soldering, be sure the assembly is placed on a
pad of conductive material. Also, be sure you, the pad, and the
soldering iron tip are grounded to the assembly. Apply as little heat
as possible when soldering.
Removing Top
Shield
Use the following steps to remove the top shield from the printed circuit
assembly (PCA). See Figure 8-1 for component locations.
1.
Remove seven Torx T8 screws
2.
Lift top shield from the back until front slots can be
disengaged from tabs.
3.
Remove the top shield.
4.
Reverse steps 1 through 3 to replace top shield.
Figure 8-1. Removing Top Shield
Chapter 8 Service 61