Hakko Electronics FR-1418, Руководство по эксплуатации и обслуживанию

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14
3.0 Process Overview
This section is intended to provide a brief and general overview of the SMT rework process using the
FR-1418. Your process and corresponding requirements may vary considerably.
The typical rework process using this equipment would include the following three phases, each of
which has several steps.
Rework Phases
I. Component Removal
II. Board and Component Preparation for Installation
III. Component Installation
Rework Phase I - Component Removal
Typical steps:
1. Load the board with the component to be removed in the board fixture.(Fig. 7)
2. Align the nozzle with the component using the video image and X/Y/Theta adjust knobs
(Fig. 8-12, 17, 18)
3. Retract Optics and lower head near board (Fig. 13-15)
4. Press <Start> to initiate the RUN/REMOVE Heat Cycle (Fig. 3, Section 4.0, Section 7.0)
5. When the heat cycle is complete, the vacuum comes on. Adjust Z height to pick up the component (Fig.
14)
6. Raise heater head (Fig. 13-15)
7. Move the component nest/CPF under the hot component (Fig. 19)
8. Lower the head near the component nest and press the VAC switch to drop the component and continue
the cycle.
9. After a timed cooling step, the cycle is complete.
10. Retract the component nest and raise the head. (Fig. 19, 14)
Note: See the items referenced after each step for additional information in this manual.
Rework Phase II - Board and Component Preparation
Practices vary widely, but they may consist of the following steps:
1. Remove excess solder and level the pads with solder wick and soldering iron (Fig. 24 & 25)
2. Print fresh solder paste onto BGA balls using CPF stencil (Fig. 26) Note: In many cases for plastic BGA
components with eutectic solder balls, a thin coating of flux paste is applied to the board in lieu of adding
additional solder paste.
3. Load CPF with BGA into component nest (Fig. 19)