GS66504B-EVBDB 650V
GaN E-HEMT Evaluation Board
User’s Guide
_____________________________________________________________________________________________________________________
GS66504B-EVBDB UG rev. 161120
© 2016 GaN Systems Inc.
www.gansystems.com 7
Please refer to the Evaluation Board/Kit Important Notice on page 29
Figure 7 Recommended probe connection with current shunt
Thermal design:
1.
GS66504B has a thermal pad at the bottom side for heat dissipation. The heat is transferred to the
bottom side of PCB using thermal vias and copper plane.
2.
A heatsink (35x35mm size) can be attached to the bottom side of board for optimum cooling.
Thermal Interface Material (TIM) is needed to provide electrical insulation and conformance to
the PCB surface. The daughter board evaluation kit supplies with a sample 35x35mm fin heatsink
(not installed), although other heatsinks can also be used to fit users’ system design.
3.
A thermal tape type TIM (Berguist
®
Bond-Ply 100) is chosen for its easy assembly. The supplied
heatsink has the thermal tape pre-applied so simply peel off the protective film and attach the
heatsink to the back of board as marked in Figure 3.
4.
Forced air cooling is recommended for power testing.
Figure 8 The daughter board with heatsink attached
CAUTION:
There is no on-board over-temperature protection. Device temperature must
be closely monitored during the test. Never operate the board with device
temperature exceeding T
J_MAX
(150
°
C)
VGL
VSL
VSW
BNC case
To oscilloscope
probe input (use
50
Ω termination)
BNC tip
V
DS
V
GS
I
D
