Gan Systems GS66502B-EVBDB, Руководство пользователя

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1. GS66508T or GS66516T has a thermal pad at the top side for improved heat dissipation. Instead
of relying on PCB for cooling, the heat can be transferred to heatsink directly from the top
reducing the total thermal resistnace.
2. A heatsink can be mounted to the board using a M3 screw with lock washer and nylon insulated
bushing. Thermal Interface Material (TIM) is needed to provide electrical insulation and
conformance to the thermal pad surface. The daughter board evaluation kit supplies with a
35x35mm heatsink with M3 tapped hole, and other heatsinks can also be used to fit users’ system
design.
3. Care should be taken during the assembly of heatsink to avoid PCB bending and mechanical
stress to the GaN E-HEMT. We recommend to limit the torque of M3 mounting screw to <1 in-lb
(0.1Nm) for GS66508T and <2 in-lb (0.2Nm) for GS66516T, which translates to about ~50psi
pressure on each device.
4. To measure device case temperature, use IR camera or install thermocouple to monitor the
temperature through two drilled holes from the top side as shown below:
VGL
VSL
VSW
BNC case
To oscilloscope
probe input (use
50
Ω termination)
BNC tip
V
DS
V
GS
I
D