MT5F22233b
© Fuji Electric Co., Ltd. All rights reserved.
5. Storage and transportation notes
26
5.1
Storage
(1) Please manage the storage location so that the temperature is 5 to 35
°
C and the humidity is 45
to 75%. If more than a year has passed since the product was manufactured under these
storage conditions, confirm that the terminal solderability is not deteriorated before mounting.
(2) Avoid exposure to corrosive gases and dust.
(3) Rapid temperature changes may cause condensation on the product surface. Therefore, store
products in a place with minimal temperature changes.
(4) During storage, it is important that nothing be placed on top of the products, since this may
cause excessive external force on the case.
(5) Store products with unprocessed terminals. Corrosion may form causing processed connections
to have high contact resistance or potential solder defects in later processing.
(6) Use only antistatic containers for storing products in order to prevent ESD damage.
5.2 Transportation
(1) Do not drop or cause impact to the products which could otherwise cause mechanical stress.
(2) When transporting several products in the same box or container, provide sufficient ESD
padding between the products to protect the terminals and to keep the products from shifting.
