MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
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Freescale Semiconductor
Package and Pin Listings
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8360E/58E is
available in a tape ball grid array (TBGA), see
Section 21.1, “Package Parameters for the TBGA Package,”
and
Section 21.2, “Mechanical Dimensions of the TBGA Package,”
for information on the package.
21.1
Package Parameters for the TBGA Package
The package parameters for rev. 2.0 silicon are as provided in the following list. The package type is
37.5 mm
×
37.5 mm, 740 tape ball grid array (TBGA).
Package outline
37.5 mm
×
37.5 mm
Interconnects
740
Pitch
1.00 mm
Module height (typical)
1.46 mm
Solder Balls
62 Sn/36 Pb/2 Ag (ZU package)
95.5 Sn/0.5 Cu/4Ag (VV package)
Ball diameter (typical)
0.64 mm