Sensors
Freescale Semiconductor
7
MMA7260QT
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
With the correct footprint, the packages will self-align when
subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
The flag underneath the package is internally connected to
ground. It is not recommended for the flag to be soldered
down.
Figure 7. PCB Footprint for 16-Lead QFN, 6x6 mm for
Consumer Grade Products and Applications
Pin 1 ID
(non-metallic)
Note:
The die pad (flag) is not generally recommended to be
soldered down for consumer product application. All dimensions
are in mm.
Do not solder down
flag and 4 corner
ground pads on the
package for
consumer application
Do not place any top
metal patterns or via
structures beneath
the package
