Freescale Semiconductor *KE02 Series, Технические данные инструкция

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Ratings
4.1 Thermal handling ratings
Symbol Description Min. Max. Unit Notes
T
STG
Storage temperature –55 150 °C 1
T
SDR
Solder temperature, lead-free — 260 °C 2
1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life .
2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices .
4.2 Moisture handling ratings
Symbol Description Min. Max. Unit Notes
MSL Moisture sensitivity level — 3 — 1
1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices .
4.3 ESD handling ratings
Symbol Description Min. Max. Unit Notes
V
HBM
Electrostatic discharge voltage, human body model –6000 +6000 V 1
V
CDM
Electrostatic discharge voltage, charged-device model –500 +500 V 2
I
LAT
Latch-up current at ambient temperature of 125°C –100 +100 mA 3
1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM) .
2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components .
3. Determined according to JEDEC Standard JESD78D, IC Latch-up Test .
• Test was performed at 125 °C case temperature (Class II).
• I/O pins pass ±100 mA I-test with I
DD
current limit at 800 mA.
• I/O pins pass +60/-100 mA I-test with I
DD
current limit at 1000 mA.
• Supply groups pass 1.5 V
ccmax
.
• RESET pin was only tested with negative I-test due to product conditioning requirement.
4
Ratings
KE02 Sub-Family Data Sheet, Rev4, 10/2014.
6 Freescale Semiconductor, Inc.