FAY-003
1-2
1.3
Specifications
SYSTEM
CPU
Intel
®
Atom™ processor
Apollo Lake N4200, 4C @ 2.50GHz CPU (Burst Mode), 750MHz GFX
(Turbo), ~6W TDP
Apollo Lake N3350, 2C @ 2.40GHz CPU (Burst Mode), 650MHz GFX
(Turbo), ~6W TDP
Memory
1 x SO-DIMM, max. 4GB, DDR3L 1333/1600/1867 non-ECC
Singal channel memory
Graphics
Intel
®
HD Graphics
I/O chipset
NUVOTON NCT6116D
LAN
1 x LAN1 connector (POE LAN RJ-45 connector, POE power connect to
2x2 2.54mm pin header)
1 x LAN2 connector (Realtek PCIe Gb LAN 8111G shares ASM1182E IC
with PCIe x1)
Audio
1 x Realtek ALC3236 Audio CODEC
TPM
1 x Nuvoton NPCT652ABCYX TPM 2.0
Expansion slots
1 x PCIe x1 straddle type
1 x Mini Card + mSATA (with SIM card) full/ half size optional by BOM
1 x M.2 E-key (22 x 30mm) for wireless devices
BIOS
16MB Flash ROM, AMI BIOS
Wake on LAN/PXE
Yes (WOL/PXE)
Watchdog Timer
1~255 steps by software program
H/W Status Monitor
Monitors CPU/System temperature
Monitors Vcore/5V/3.3V/12V voltages
Smart Fan Control
Yes
Power State
S3, S4, S5
Graphics
Graphics chipset
Intel
®
HD Graphics
Graphics multi
display
eDP or LVDS +DP, eDP or LVDS +HDMI, HDMI+DP,
HDMI+DP+eDP or LVDS
HDMI
Up to 3840 x 2160 (HDMI 1.4b)
eDP
Up to 3840 x 2160 (colay LVDS, optional by BOM)
DP
Up to 4096 x 2160 @60 Hz (support DP1.2)
LVDS
Up to 1920 x 1200 @ 60Hz, resolution read from EEPROM
LVDS Inverter
Control
Voltage / PWM, 1 x DC 5V/12V for LCD backlight inverter board
Environement & Power & ME
Battery
Lithium battery
Power requirement
1 x 2-pin onboard power input connector (12 VDC ±10%)
Operating
temperature
32
o
F~140
o
F (0
o
C~60
o
C)
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