USER MANUAL
TCM 410J
–
Transceiver Module
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TCM 410J User Manual | v2.3 | June 2022 | Page 38 / 46
4.5
Soldering information
TCM 410J shall be soldered according to IPC/JEDEC J-STD-020C standard.
TCM 410J shall be handled according to Moisture Sensitivity Level MSL3 which means a
floor time of 168 h. TCM 410J may be soldered only once, since one time is already con-
sumed at production of the module itself.
Once the dry pack bag is opened, the desired quantity of units should be removed and the
bag resealed within two hours. If the bag is left open longer than 30 minutes the desiccant
should be replaced with dry desiccant. If devices have exceeded the specified floor life time
of 72 h, they may be baked according IPC/JEDEC J-STD-033B at max. 90°C for less than
60 h.
Devices packaged in moisture-proof packaging should be stored in ambient conditions not
exceeding temperatures of 40 °C or humidity levels of 90% r.H.
TCM 410J modules shall be soldered within 6 months after delivery!
