Pin Name
Module Connector Pins
Voltage
Maximum
Comment
Current
VCC_3V3
A-26, 29, 50, 86
3.3 V
±
5%
4 A
Always active
B-55, 79, 115, 127, 152, 155
(and max 0.3 A
C-96, 103, 136, 143
per pin)
VCC_2V5
A-53, 62, 65, 89
2.5 V
±
5%
0.25 A
Controlled by PWR_EN
VCC_1V8
B-52, 76, 108, 128
1.8 V
±
5%
1 A
Controlled by PWR_EN
C-83, 123, 165
Table 18: Voltage Supply Outputs
Warning!
Do not connect any power supply to the voltage supply outputs nor short circuit them to GND, as this
may damage the XU1 SoC module.
2.11.5
Power Consumption
Please note that the power consumption of any MPSoC device strongly depends on the application (on the
configured bitstream and I/O activity).
To estimate the power consumption of your design, please use the Xilinx Power Estimator available on the
Xilinx website.
2.11.6
Heat Dissipation
High performance devices like the Xilinx Zynq Ult MPSoC need cooling in most applications; always
make sure the MPSoC is adequately cooled.
Table 19 lists the heat sink and thermal pad part numbers that are compatible with the XU1 SoC
module. Details on these parts and additional information that may assist in selecting a suitable heat sink
for the XU1 SoC module can be found in the Enclustra Modules Heat Sink Application Note [18].
Product Name
Package Name
Heat Sink Part Number
Thermal Pad Part Number
XU1
FFVC900 [24]
ATS-52310G-C1-R0
TG6050-30-30-1
Table 19: Heat Sink Type
Please note that the provided parts are recommended for prototyping purposes. In cases where the module
in used in environments subject to vibrations, a heat sink with a clip may be required for optimal fixation.
19
The maximum available output current depends on your design. See sections 2.11.1 and 2.11.5 for details.
20
On revision 1 modules, the 2.5 V converter cannot be disabled via PWR_EN signal.
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Version 13, 15.08.2019
