P200-10-033
Issue A
Material Declaration
In accordance with the requirements of the Chinese regulatory requirement on the Management Methods for the
Restriction of the Use of Hazardous Substances in Electrical and Electronic Products Order No. 32 (also known as
‘China RoHS2’) and SJ/T 11364 Marking for the Restricted Use of Hazardous Substances in Electronic and Electrical
Products:
Product
Product Label
Meaning
Turbomolecular pumps:
D39614000 EXC300
D39615000 EXC300M
D39616000 EC120
D39617000 EXC120E
This product contains hazardous substances in at least
one of the homogeneous materials used which are
above the limit requirement in GB/T 26572 as
detailed in the declaration table below.
These parts can safely be used for the environmental
protection use period as indicated.
材料成分声明
Materials Content Declaration
部件名称
Part name
有害物质
Hazardous Substances
铅
Lead
(Pb)
汞
Mercury
(Hg)
镉
Cadmium
(Cd)
六价铬
Hexavalent
Chromium
(Cr VI)
多溴联苯
Polybrominated
biphenyls (PBB)
多溴二苯醚
Polybrominated
diphenyl ethers
(PBDE)
印刷电路组件
(PCA)
Printed Circuit
Assembly (PCA)
X
O
X
O
O
O
电缆
/
电线
/
连
接器
Cable/wire/connector
X
O
O
O
O
O
机械部件
Mechanical Components
X
O
O
O
O
O
O:
表 示 该 有 害 物 质 在 该 部 件 的 所 有 均 质 材 料 中 的 含 量 低 于
GB/T 26572
标 准 规 定 的 限 量 要 求 。
O: Indicates that the hazardous substance contained in all of the homogeneous materials for this part is
below the limit requirement in GB/T 26572.
X:
表示该有害物质在该部件的至少一种均质材料中的含量超出
GB/T26572
标准规定的限量要求。
X: Indicates that the hazardous substance contained in at least one of the homogeneous materials used for
this part is above the limit requirement of GB/T26572.
NOTE: These products are EU RoHS compliant, the following Exemptions apply:
6(b) Lead as an alloying element in aluminium containing up to 0.4% by weight
6(c) Copper alloy containing up to 4% lead by weight
7(a) Lead in in high melting temperature type solder (i.e. lead based alloys containing 85% by or more)
7(b) Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling,
transmission, and network management for telecommunications
7(c) I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g.
piezoelectronic devices, or in a glass or ceramic matrix compound
7(c) II Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher
8(b) Cadmium and its compounds in electrical contacts
15 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip
chip packages
34 Lead in cermet-based trimmer potentiometer elements
Содержание EXC120
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