
8
01 上部加热Y轴调节手柄
02 上部加热Z轴调节手柄
03 发热器组
04 发热器射灯
05 下部测温器
07 下部发热器板
09 上部温控器
11 下部温控器
12 冷却开关
13 启动
14 停止
08 横流风扇
10 电脑连接口
06 PCB托板
Introduction of host labels
:
1. Top heater temp control 2. Bottom heater temp control
3. Top breeze adjust 4. IR Light Beam
5. Running show 6. Stop
7. Cooling AUTO/HAND 8. Power
9. Heat box 10. PCB fixer
11. Heater
Specification:
1
.
Total power
:
3.2 KW
2
.
Top heater
:
0.8 KW
3
.
Bottom heater
:
2.4KW
4
.
Power supply
:
220V±10 50Hz±3
5
.
Dimension
:
450×400×580mm
6
.
Temperature control
:
K sensor
7
.
Positioning: V-groove for PCB positioning
Max PCB size:
280×320mm
mm
8
.
Weight
:
20kg
Features
:
1. Choose imported high-precision materials (temperature sensor, PLC, heater) to control BGA
desoldering & soldering procedures precisely.
2. Top & bottom temperature areas heat independently, And it can set up 8 rising temperature
segments and 8 constant temperature segments to control. It can save 10 groups of temperature
curves at the same time.
3. Choose imported high-precision thermocouple to detect the top/bottom temperature precisely.
4. Top & bottom heating can be controlled independently by the temperature graphs. A cross-flow
fan cools rapidly to protect the PCB from deformation when welding.
Содержание ZM-DGC900
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