DGC ZM-DGC900 Скачать руководство пользователя страница 3

 

A. Company Profile     

DGC as quality control specialist in China started operations since 2007, with the Union of 

intelligent human resources from China and Overseas, it has since then paved the way for Chinese 
brand best products in outside markets, also promote and develop strategies for different products 
according to languages and needs have been basic in DGC objectives. DGC now is involved 
directly in the production of different lines for specific markets according to the conclusion of the 
studies about each field, and the real needs for those. 

Shenzhen Machine Co., Ltd. is located in one of the most prosperous parts—Xixiang, with 

Shenzhen International Airport to its south and State Hwy. 107 as well as Shenzhen-Guangzhou 
Superhighway to its north, enjoying convenient transportation. 

Shenzhen Zhuomao Co., Ltd. aims to expand the market with advanced thinking and 

pioneering philosophy; seizes the market with strong technical expertise; ensures the high quality of 
the products with modern scientific management and mature advanced technology; and offers our 
clients the best service with perfect sales network and high-quality staff. 

We sincerely hope that our products will bring you more and more profits and wealth. 

 

 

B. BGA Rework Station  

 
1. Knowledge about BGA

 

BGA is short for Ball Grid Array. It is a kind of package method which use organic carrier in IC. It 
has the following features:  

Small 

package area.            

Greater functions and more pins.

 

Self

-centerize while PCB puddle welding, easy to put on tin.    More reliable.

 

Good conductivity and low overall cost.  

 

Memory which applies BGA can enlarge the memory capacity by 2 to 3 times 

while the volume of memory remains the same. Compared with TSOP, BGA is much 
smaller and better at radiating and conducting electricity.  

 

2.

 

Types and Features of BGA 

a. Types  
According to the encapsulation material, BGA can be classified into the following types: 
          (1)PBGA

Plastic BGA

 

          (2)CBGA

Ceramic BGA

 

          (3)CCBGA

Ceramic Column BGA

 

          (4)TBGA

Tape BGA

 

          (5)CSP (Chip Scale Package or MBGA) 
b. Features  
Compared with QFP, BGA has the following features: 
(1)

 

I/O terminal space is big (eg. 1.0mm, 1.27mm, 1.5mm), and it can accommodate 

more I/O.  
 
(2)

 

More reliable package, low rate of welding defects and welding spot durable. 

(3)

 

Paraposition of QFP is usually observed with naked eyes. When the pin space is 

smaller than 0.4mm, it is hard to paraposition and weld. While the pin space of 
BGA is bigger, by applying the paraposition-amplification device, it is easy to 
paraposition and weld.  
(4)

 

The welding coplanarity of BGA is better than QFP, because solder can make up 

the flat error between BGA and PCB after melting. 
(5)Good electrical property. The pins are small, the selfinductance and mutualinductance 
of the conductivity is low, and the frequency characteristic is good. 

 

3

Содержание ZM-DGC900

Страница 1: ...1 BGA Rework Station ZM DGC900 SOFTWARE SOLUTIONS Address Office 12D Fuxin Building 318 Fuhua Road 558000 Shenzhen China Telephone 86 0755 88360496 Fax 86 0755 83292149 Http www dragongroupchina com...

Страница 2: ...BGA Rework Station C Installation D Safety Cautions E Introduction of Structure F Operation Steps G PLC Programmable logic Controller H Curve Program Controller I Related information J Tips for opera...

Страница 3: ...ll Grid Array It is a kind of package method which use organic carrier in IC It has the following features Small package area Greater functions and more pins Self centerize while PCB puddle welding ea...

Страница 4: ...welding paste will flow from the welding pad to the rabbet then leads to short circuit between welding pad and rabbets nearby The geometric shape and diameter of welding pad The compactness of pins ha...

Страница 5: ...no more than 20 of the solder ball s diameter 2 Desoldering spots No desoldering spots 3 Bridging and short circuit When there is extra solder or the solder is not put on the right place bridging and...

Страница 6: ...and time For example reflux temperature of CBGA BGA should be higher than that of PBGA choose the higher reflux temperature For no clean solder paste its activity is lower than non no clean solder pa...

Страница 7: ...fire or an electric shock 7 There are high pressure parts in the circuit box Don t disassemble it 8 If some metals fall in the rework station when it is working turn off the power immediately After i...

Страница 8: ...positioning Max PCB size 280 320mm mm 8 Weight 20kg Features 1 Choose imported high precision materials temperature sensor PLC heater to control BGA desoldering soldering procedures precisely 2 Top bo...

Страница 9: ...d down and the damage caused by temperature difference is less To use some flux paste when cleaning the pad can increase the solder activity and achieve better cleaning effect Be careful to not to des...

Страница 10: ...of 1 2 3 4 5 0 and the temperature graphs choose NO X from ten groups take NO 1 group as an example D I S P S E L E S E T P R O G R U N P R O G P T N P A R S E T H A N D A U T O P V S V P C 4 1 0 P T...

Страница 11: ...R O G P T N P A R S E T H A N D A U T O P V S V P C 4 1 0 P T N S T E P P R O R U N O U T 1 O U T 2 S V A L 1 M A N M V T I M E C O M A L T E C 1 L 1 1 6 0 0 0 4 Preheating section time d set Press th...

Страница 12: ...L 1 M A N M V T I M E C O M A L T E C 1 L 2 1 8 5 7 Enter the second section constant temperature time set press UP DOWN to modify Press the PAR to define D I S P S E L E S E T P R O G R U N P R O G...

Страница 13: ...OWN to modify Press the PAR to define D I S P S E L E S E T P R O G R U N P R O G P T N P A R S E T H A N D A U T O P V S V P C 4 1 0 P T N S T E P P R O R U N O U T 1 O U T 2 S V A L 1 M A N M V T I...

Страница 14: ...1 M A N M V T I M E C O M A L T E C 1 d 4 3 5 14 Enter the fifth section heating up speed set press UP DOWN to modify Press the PAR to define D I S P S E L E S E T P R O G R U N P R O G P T N P A R S...

Страница 15: ...ND AUTO P V SV P C410 P TN ST EP PRO RUN O UT1 OUT2 SV AL1 MAN M V TIME C OM ALTEC 1 r8 End Remarks if you need to increase the temperature then press the UP to open 18 Set finished then it will show...

Страница 16: ...set to prog TIME shows the remaining time of certain period of procedures While the meter is set to constant temperature controller TIME shows cent code In some special type of instrument TIME shows t...

Страница 17: ...SELECT button the lower screen shows settings value the output value or the remained time of operation the corresponding indicator SV MV TIME are on AUTO HAND is the automatic manual switch button Whe...

Страница 18: ...measured value is not vibrating After 1 5 periods of vibration the PID self setting is completed Then the AT lamp is off The meter can calculate the best PID parameter and save it in the meter accordi...

Страница 19: ...state of auto control f Software configuration code and meaning of function parameters Set the configuration password as 808 the parameter code Loc when the meter shows PV press button PAR and for 3 s...

Страница 20: ...sistance signal Distant transmission pressure resistance signal with decimal 8 Rddr Local address 0 99 9 bRud Communication baud rate 600 1200 2400 4800 9600 19 2KB 10 Ctrl Regulation On of PLd rSP Pr...

Страница 21: ...should be no less than 20s Regulation parameter ProP ln dEr rEL C ProP ln dEr rEL C are the four regulation parameters directly affecting control precision RL02 on Second alarming output Action suctio...

Страница 22: ...proportion then mutiplied by cooling coefficient Control mode parameter Rc When Rc is set at rEu the control mode is reverse acting control It means that as the input signal of the meter increases the...

Страница 23: ...varies according to different objects PID is over AT go out P I D parameters which have been set before will be kept in the meter automatically If we need to examine P I D parameters after setting we...

Страница 24: ...d for 3s the meter can enter the menu of curve program menu the upper screen display the code of the first parameter and the bottom one display the value of parameter Then we can change the value by a...

Страница 25: ...s the basic setting 2 Modification of parameters when the curve procedure runs a When the meter runs we can t modify the curve program parameter LC r1 L1 d1 r2 L2 d2 But other parameters can be modifi...

Страница 26: ...26...

Страница 27: ...use IR because the ceramic heater can t cool down very quickly thus it is difficult to control the time of higher reflow temperature However the convection can control strictly and it is conductive to...

Страница 28: ...he standard choice in USA Components manufacturers consider the using of lead free balls as the standard b Setting of temperature difference The temperature difference on the surface of components is...

Страница 29: ...te are necessary because the melting point of soldering balls on CBGA is much higher than common paste such as Sn63 and pb27 4 Removal of residual soldering tin and mounting of BGA Besides the tempera...

Страница 30: ...time The upper main heater arises to 8 10mm from the surface of BGA and pauses for 30 40s Or after the working light is off move the main heater away and take PCB away from the positioning bracket 5 B...

Страница 31: ...meet the fast increasing demand of BGA circuit assembly the manufacture companies need to choose safer faster and more convenient assembly and rework technology Appendix packing list Order Name Speci...

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