9
Chapter 2
HARDWARE INSTALLATION
User's Manual |
WL9A3
•
LPDDR3 2133MHz memory
•
8G or 16G memory down
•
Dual channel memory interface
X
System Memory
Features
The system board supports the following memory interface.
Single Channel (SC)
Data will be accessed in chunks of 64 bits from the memory channels.
Dual Channel (DC)
Data will be accessed in chunks of 128 bits from the memory channels. Dual channel provides
better system performance because it doubles the data transfer rate.
Single Channel
DIMMs are on the same channel. DIMMs in a channel can be identi-
cal or completely different. However, we highly recommend using
identical DIMMs. Not all slots need to be populated.
Dual Channel
DIMMs of the same memory configuration are on different channels.
Carrier Board
COM Express
module
CPU Cooler /
Heatsink
X
Assembly
A CPU cooler / Heatsink may be included in the package. The CPU cooler / Heatsink contains
four spring screws and shall be installed after the COM Express module is securely mounted
onto the carrier board. Please make sure the cooler, the module, and the carrier board are ori-
ented correctly by inspecting whether the screws, screw holes, and stand-offs all align.
Note:
The carrier board is not included in the standard package and is typically custom-
ized.
LPDDR3
LPDDR3
Intel
BGA 1528
SPI Flash BIOS
Intel
I219LM
DDR3
DDR3
Bottom View
Top View
SIO
IT8528E
eMMC
PTN3460
COM Express B2B
DDR3
DDR3
Intel
BGA 1528
SPI Flash BIOS
Intel
I219LM
DDR3
DDR3
Bottom View
Top View
SIO
IT8528E
eMMC
PTN3460
COM Express B2B
DDR3
DDR3