Thermal restriction for ASHRAE A4/Fresh air environment
(UI)
•
Two PSUs are required in redundant mode. Single PSU failure is not supported
•
LRDIMM is not supported.
•
Processor TDP equal or greater than 155 W are not supported.
•
128 GB or greater capacity DIMMs are not supported.
•
Both SW and DW GPGPU are not supported.
•
PCIe card without EOT (max 65°C inlet temperature) and cooling tier 5 and above are not supported (UI).
•
PCIe SSD is not supported.
•
BOSS and OCP are not supported (UI).
•
PCIe card TDP greater than 25 W is not supported.
•
Rear drive configuration is not supported.
Shared requirements across all categories
Table 62. Shared requirements across all categories
Allowable operations
Maximum temperature gradient (applies to both operation and
non-operation)
20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in
15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware
Non-operational temperature limits
-40 to 65°C (-40 to 149°F)
Non-operational humidity limits
5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude
12,000 meters (39,370 feet)
Maximum operational altitude
3,048 meters (10,000 feet)
*: Per ASHRAE thermal guidelines, these are not instantaneous rates of temperature change.
Table 63. Maximum vibration specifications
Maximum vibration
Specifications
Operating
0.26 Grms at 5 Hz to 350 Hz (all operation orientations)
Storage
1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 64. Maximum shock pulse specifications
Maximum shock pulse
Specifications
Operating
24 executed shock pulses in the positive and negative x, y, and z axis of 6 G for
up to 11 ms. (4 pulse on each side of the system)
Storage
Six consecutively executed shock pulses in the positive and negative x, y, and z
axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Thermal restriction matrix
Table 65. Label references
Label references
STD
Standard
HPR
High Performance
HSK
Heat sink
LP
Low Profile (Riser)
Technical specifications
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