6.3 Cleaning
¡
Clean the soldered side of the power module with a brush.
Prevent liquid from getting into the power module. Do not clean by
soaking the power module into liquid.
¡
Do not allow solvent to come in contact with product labels or res-
in cases as this may change the color of the resin case or cause
deletion of the letters printed on the product label.
¡
After cleaning, dry the power modules well.
6.4 Soldering temperature
¡
Flow soldering: 260
C
for up to 15 seconds.
¡
Soldering iron (26W): 450
C
for up to 5 seconds.
6.5 Derating
¡
Use the power modules with conduction cooling (e.g. heat dissipa-
tion from the aluminum base plate to the attached heat sink).
Fig. 6.3 shows the derating curves with respect to the aluminum
base plate temperature. Note that operation within the hatched
areas will cause a signifi cant level of ripple and ripple noise.
¡
Please measure the temperature on the aluminum base plate
edge side when you cannot measure the temperature of the cen-
ter part of the aluminum base plate.
In this case, please take 5deg temperature margin from the derat-
ing characteristic of Figure 6.3.
6.2 Stress onto the pins
¡
Applying excessive stress to the input or output pins of the power
module may damage internal connections. Avoid applying stress
in excess of that shown in Fig. 6.1.
¡
Input and output pins are soldered onto the internal PCB. Do not
bend or pull the leads with excessive force.
¡
As unexpected stress may be applied to the pins, set the diameter
of the PCB mounting hole at 3.5mm.
¡
As unexpected stress may be applied to the pins from vibration
or shock, fi x the power module by using the mounting holes with
screws to reduce stress.
¡
Fix the power module to the PCB with the screws before soldering
the input and output pins to prevent the PCB pattern being dam-
aged.
+VOUT, -VOUT
39.2N(4kgf)
39.2N(4kgf)
Less than
Less than
Less than
39.2N(4kgf)
19.6N(2kgf)
19.6N(2kgf)
19.6N(2kgf)
Others
Less than
Less than
Less than
-VIN
RC
+VIN
+VOUT
TRM
-VOUT
+VOUT
+S
TRM
-S
-VIN
-VOUT
+VIN
RC
DC-DC Converters Bus Converter.Power Module Type
Instruction Manual
DHS-21
DHS
Fig. 6.1 Shield pattern lay out (bottom view)
+VOUT
-VOUT
+VIN
-VIN
-VIN
+VIN
-VOUT
Shield pattern
Shield pattern
+VOUT
DHS50, DHS100
DHS200, DHS250
DHS50, DHS100
DHS200, DHS250
Fig. 6.2 Stress onto Pins
me̲dhs1.indd DHS-21
me dhs1 indd DHS-21
2015/06/19 11:08:05
2015/06/19 11:08:05
