EK–SMCPR–UG. A01
387404-001
v
Contents
Revision Record ...................................................................................................... xiii
About This Guide ......................................................................................................xv
1
Product Description
1.1 Subsystem Overview.................................................................................................. 1–1
1.2 Major Components .................................................................................................... 1–6
1.2.1 Array Controllers .................................................................................................... 1–8
1.2.2 SCSI Buses .......................................................................................................... 1–10
1.2.3 Single-Ended I/O Module (SE I/O) ...................................................................... 1–11
1.2.3.1 Expanding the UltraSCSI Bus ............................................................................ 1–12
1.2.3.2 Controlling the Internal SCSI Bus ..................................................................... 1–13
1.2.3.3 Controlling the External SCSI Bus .................................................................... 1–13
1.2.3.4 Controlling the Fault Bus .................................................................................. 1–13
1.2.3.5 “Warm Swapping” I/O Modules and Cables...................................................... 1–13
1.2.3.6 Maximum Bus Length....................................................................................... 1–14
1.3 Error Detection and Reporting ................................................................................. 1–14
1.3.1 Fault Bus ............................................................................................................. 1–14
1.3.2 Environmental Monitor Unit (EMU) .................................................................... 1–15
1.3.2.1 EMU Front Panel .............................................................................................. 1–13
1.3.2.2 Array Controller Status ..................................................................................... 1–17
1.3.2.3 I/O Module Status ............................................................................................. 1–17
1.3.2.4 Enclosure Configuration Information ................................................................ 1–17
1.3.3 Power Verification and Addressing (PVA) Module .............................................. 1–18
1.3.3.1 Monitoring Power Supply Operation ................................................................. 1–19
1.3.3.2 Master Enclosure Controlled Power Shutdown.................................................. 1–20
1.3.3.3 Expansion Enclosure Initiated Power Shutdown ................................................ 1–21
1.4 Storage Device SBBs .............................................................................................. 1–22
1.5 Power Configuration ............................................................................................... 1–22
1.5.1 AC Input Power Entry Controllers ....................................................................... 1–23
1.6 Power Supply SBBs ................................................................................................ 1–24
1.7 Standard (4 + 1) Power Configuration..................................................................... 1–25
1.8 Redundant (4 + 4) Power Configuration .................................................................. 1–26
1.9 ECB SBBs .............................................................................................................. 1–28
