Chassis Plans ATXP-875P, Техническое описание

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Appendix A: Technical Specifications ATXP-875P – Technical Reference
50 Chassis Plans
Industrial Devices
Temperature and Voltage Device
Automatic CPU voltage & temperature monitoring device (optional).
Power Management
Power button function: advanced power management support.
General Purpose I/O lines
Ten general purpose I/O lines in a header.
On-Board POST Display Diagnostics
Miscellaneous
CMOS/Battery
RTC with lithium battery.
Control Panel Connections
Reset, Soft Power, Speaker. LEDs for power and IDE.
CPU Socket
Standard ZIF (Zero Insertion Force), mPGA 478.
Form Factor
ATX form factor (9.6” x 12”).
PCB Construction
Six Layers, dry film mask.
Manufacturing Process
Automated surface mount.
Table A-1 Environmental
Environmental Operating Non-operating
Temperature
0
°
to +55
°
C -40
°
to +65
°
C
Humidity
5 to 95% @ 40
°
C non-
condensing
5 to 95% @ 40
°
C non-
condensing
Shock 2.5G @ 10ms 10G @ 10ms
Vibration 0.25 @ 5-100Hz 5 @ 5-100Hz