SEMI E69
Test method for reproducibility and zero drift for thermal MFCs
SEMI E80
Test method for determining attitude sensitivity of MFCs
SEMI E16-90
Guidelines for determining and describing mass flow controllers leak rates
SEMI F19
Specification for the finish of the wetted surface of electro polished
216L stainless steel components
SEMI F20
Specifications for 316L stainless steel bar, extruded shapes, plate, and
investment castings for components used in ultra-high purity semi
manufacturing applications
SEMI F36
Guide for dimensions and connections of gas distribution components
SEMI F37
Method for determination of surface roughness parameters for gas
distribution system components
SEMI F44
Guideline for standardization of machined stainless steel weld fittings
SEMI F45
Guideline for standardization of machined stainless steel reducing fittings
SEMI F47
Specifications for semiconductor processing equipment
voltage sag immunity
SEMI S2
Environmental, Health and Safety Guidelines
SEMI S9
Dielectric testing
SEMI S10
Risk assessment
SEMI S12
Decontamination of fielded products
ETG.1000.2
Physical Layer service definition and protocol specification
ETG.1000.3
Data Link Layer service definition
ETG.1000.4
Data Link Layer protocol specification
ETG.1000.5
Application Layer service definition
ETG.1000.6
Application layer protocol specification
ETG.1020
EtherCAT Protocol Enhancements
ETG.2000
EtherCAT Slave Information
ETG.5001.1
Modular Device Profile - Part 1: General MDP Device Model
ETG.5003.1
Semiconductor Device profile - Part 1: Common Device Profile (CDP)
ETG.5003.2020
Specific Device Profile: Enhanced Mass Flow Controller
ETG.5003.2021
Specific Device Profile: Mass Flow Controller
ETG.5003.2022
Specific Device Profile: Mass Flow Meter
ETG.5003.2023
Specific Device Profile: Enhanced Mass Flow Meter
Glossary of Terms and Acronyms
Table 1-2 Terms and Acronyms
Term or Acronym
Definition
CSR
Customer Special Requirement
CVD
Chemical Vapor Deposition
DeviceNet
A 5-wire local network I/O communication device that employs a command/response
communication protocol
DSP
Digital Signal Processor
EPI Epitaxy (EPI)
A process technology where a pure silicon crystalline structure is deposited or “grown”
on a bare wafer, enabling a high-purity starting point for building the semiconductor
device.
HBD
Horizontal Base Down
GP200 Series
Pressure Based Mass Flow Controller
Section 1 Introduction
3
Содержание GP200 Series
Страница 1: ...Installation Operation Manual GP200 Series Metal Sealed Pressure Based Mass Flow Controllers ...
Страница 10: ...Table 1 3 Specifications for GP200 Series Section 1 Introduction 6 ...
Страница 11: ...Section 1 Introduction 7 ...
Страница 12: ...Figure 1 1 Dimensions of GP200 Series Downport Configurations Section 1 Introduction 8 ...
Страница 13: ...Figure 1 2 Dimensions of GP200 Series VCR Configurations Section 1 Introduction 9 ...