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2.15.8 Thermal Management: Heatsink and Fan Assembly
Depending on the end-user application, the performance of the UltraZed-EG SOM will require a thermal
solution to help maintain performance across temperature.
The UltraZed-EG SOM comes populated with an example thermal solution of a 19.05mm Heatsink and Fan
assembly (Heatsink + Fan + Hardware Height). This active arrangement is secured directly to the Zynq
Ult MPSoC via 3M thermal tape. A Cool Innovations Heat Sink (PN:
3-101002UBFA
) and a Sunon
5V DC Fan (PN:
MC25100V1-000U-A99
) are assembled and shipped with the UltraZed-EG SOM.
The active heat sink is powered by connecting a three position connector to the 5V fan mating connector on
an end-user carrier card. This 3-
pin keyed connector is .100” pitch and has the 5V conductor as pin 2 on
the connector. For reference, the fan supplied with the UltraZed-EG SOM mates with the fan header on the
UltraZed IO Carrier Card.
Under most circumstances this 19.05mm Heatsink and Fan assembly should provide adequate relief across
temperature, but it cannot be guaranteed to support all environmental conditions due to lack of knowledge
regarding end-users thermal environment and the possible enclosure of the UltraZed-EG SOM. For
aggressive applications it is recommended that an accurate worst-case power analysis be performed in
order to avoid the pitfalls of ov
er designing or under designing your product’s power and thermal
management system.
NOTE: End users should design a custom Heatsink and Fan assembly that is more conducive to the
requirements of their system including alternative mounting techniques for the assembly which
could enhance the thermal reliability of the system.
Figure 20
– UltraZed-SOM with 19.05mm 5VDC HeatSink and Fan Assembly