2
Floor Life and maximum storage time
The moisture sensitivity classification is MSL2a according
to JEDEC J-STD-020D.
Unopened
moisture barrier bagged devices
can be stored
up to 12 months in an environment with a temperature
between 5° C and 50° C and a relative humidity (RH) not
exceeding 90%.
Unpacked devices can be kept in a production environ-
ment up to 4 weeks provided a temperature not exceed-
ing 30° C and a relative humidity (RH) not exceeding 60%.
For higher temperatures in the production environment
the floor life is shortened (see Table 1).
Table 1. MSL2a floor life
[1]
Normal
Accelerated Equivalent
4 weeks
5 days
≤ 30° C
≤ 60° C
60% RH
60% RH
[1] Max. storage time without humidity protection pack/ after opening
moisture barrier bag
Baking
When the devices are inserted and soldered into a MOST
£
system up to four weeks after they have been taken out
of the moisture barrier bag, then the moisture level in
the mold material is low enough to ensure minimum
mechanical stress while soldering.
If the devices are kept on the production floor for more
than four weeks as described in the last paragraph, it is
advised to bake the devices before soldering.
Baking is done by removing the devices from the tube and
placing them in a shallow container so that the package
bodies do not touch each other. Then the devices are
placed in the bake oven, heating the devices to 100° C for
24 hours. After this procedure, the moisture content of
the devices is low and the moisture-induced stress during
soldering is reduced. As a general guideline baking is
recommended before every soldering attempt.
The baking procedure can be done as often as necessary.
Figure 4. Warning sign for an ESD protected area
Electrostatic Discharge (ESD) Protection
The devices are sensitive to electrostatic discharges and
therefore must be handled with care in an ESD protected
area, indicated with the sign as shown in Figure 4.
An ESD event may damage or degrade the device perfor-
mance.
The standard DIN 61340-5-1 has to be considered. The fol-
lowing ESD preventions should be applied. Any smaller
ESD prevention program might be unsuitable to prevent
ESD damages.
x
ESD floors
x
ESD tables, ESD work surfaces and ESD storage facilities
(e.g. trolleys and carts)
x
ESD wrist straps/connectors for wrist straps
x
ESD footwear and garments (cotton or special released
materials)
x
ESD gloves or finger cots
x
ESD chairs
x
ESD tools (e.g. nippers)
x
ESD preventions at equipment parts (Equipment parts
which may directly contact the device leads must be
made of dissipative materials, wherever possible. If
dissipative materials cannot be used for technical
reasons, metals must be used whose natural non-
conductive surface layer is sufficiently thin (breakdown
voltage <10 V). Conducting machine parts which may
contact the device leads directly must be connected to
ground without a series resistor. Electrical fields in the
neighborhood of the device must not exceed 10
4
V/m.
x
ESD packing materials
