3
Shortening and Lead Bending
The leads of the devices can be bent once to a maximum
of 90°, not closer than 1 mm from the edge of the cut
lead wires between the leads. The minimum bend radius
is 0.25 mm. While applying the bending force on the leads,
a counter force must be in place to ensure no forces are
exerted onto the package. See Figure 6 for an overview.
Figure 6. Bending force and counter forces [mm)
Device Mounting
The devices are designed for through-hole mounting on a
PCB. The minimum distance from the package to the PCB
is mechanically defined with lead frame stops (leadframe
dambar). The lead frame stops are designed to ensure the
positioning of the optical axis 5.1 ±0.1 mm above the PCB
(see Figure 7).
Figure 7. Transmitter and receiver module on PCB [mm]
Figure 5. Applied force locations [mm]
ESD Classification
The devices passed the following ESD tests:
Human Body Model (HBM) with U = ±2 kV according JEDEC
standard JESD22-A114 (Electrostatic Discharge (ESD) Sen-
sitivity Testing Human Body Model (HBM))
Socket Device Model (SDM) with U = ±500 V accord-
ing Electrostatic Discharge Association standard ANSI/
EOS/ESD-DS5.3 (ESD Sensitivity Testing Charged Device
Model)
Handling
The devices must be handled with care. Above all it has to
be ensured that no force should affect on the device leads
without the precautions detailed under “Forces on Leads”
and “Shortening and Lead Bending”. The optical port has
to be kept clean at all events.
Forces on Leads
The devices passed the following mechanical lead tests ac-
cording to JEDEC standard JESD22-B105 (Lead Integrity):
x
Lead-pull: the maximum pull on the leads is 2.27 ±0.14 N,
for 30 seconds.
x
Lead-bend: the maximum lead bending angle is 30°,
measured at the lead extremities for one cycle.
x
Lead-torsion: the maximum torque to be applied is
14.5 ±1.4 N•mm at the lead, 3.05 mm from the package
at an angle of 30°, for one cycle.
See Figure 5 on the location of the lead forces.
