
11
Appendix B: Bill of Materials for Components Shown on schematic
Comment
Footprint
Quantity
Chip RES 240R 1%
0805
1
Chip RES 2.7k 1%
0805
1
Chip RES 10k 1%
0805
2
Chip RES 20k 1%
0805
4
Chip RES 100k 1%
0805
1
Chip RES 12.7k 1%
0805
1
Cer. Cap 470pF
0805
1
Cer. Cap 100nF
0805
6
CAP TANTALUM 4.7uF 20V
CASE A
2
CAP TANTALUM 2.2uF 10V
CASE A
2
Photo Transistor
DIP
1
2N3906
TO92
1
Resonator 6MHz
SMD
1
Resonator 24MHz
DIP
1
ADNS-6010
DIP
1
SPC825A
DIP24 1
25LC040/P (4 K bit / 512B)
SOIC
1
FRICTION LOCKED
HEADLOCK5P
1
PIN HEADER 2mm(x2 row)
DIP
1
Photo LED
DIP
1
LP2950ACZ-3.3
T092
1
Jumper RED
DIP
1
Jumper BLK
DIP
1