VIPEDIA-12 – Installation Guide
U-0641-0344.doc – Issue: 06 complete, approved
Page 43 of 44
Packing for Return for Repair
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!
All electronics assemblies must be
properly packed in ESD protective
packing for transport, to prevent physical
and ESD damage.
!
!
The filler material used for packing for
return for repair must be antistatic or
static dissipative, as this may come into
contact with exposed connectors, wiring,
or PCB assemblies. The use of non-
conductive filler material may cause
damage to the electronic assemblies
reducing their operational life, or even
destroying them.
Advice on packing the product for return can be provided
by ASL.