Air-Vac PCBRM15, Руководство пользователя

Страница: 67 / 120

PCBRM15 & PCBRM System 5.2 User’s Manual Chapter 4: Processes & Applications
Part No. 4005.00.906
4-25
Component Removal Process Notes
Board must be clamped. If not, when removing the component leads may catch in the barrels and lift the
board away from the solder wave during reflow.
Do not set Air Cleaning System too high. It is dangerous and will not improve cleaning of the barrels.
Raising the board preheat temperature may increase the effectiveness of the air cleaning procedure.
For large or low melt plastic devices it is important to apply even removal force when lifting the device
from the board. Two tools/hands may be required. Tools which apply uniform pressure, no pinch points,
will be most effective for low melt plastic devices.
It may be required to use a secondary operation to clean 100% of the board barrels. A vacuum
desoldering hand tool and/or solder wick can be used for most applications.
In the automatic mode the end of solder flow is indicated by an audible signal. Do not attempt to remove
component after the signal.
The board must remain rigid and level during the removal process. Do not pull the board upward away
from the wave or push downward into the wave since this will cause flooding. Fixturing may be required.
4.15 Component Replacement
Reference Soldering procedure.
4.15.1 Automatic Method
After the holes have been cleaned, flux the leads and bottom of the board.
Follow Soldering procedure.
4.15.2 Manual Method
It is possible to insert a replacement component during the removal process while the solder is flowing.
If the operator has sufficient skill, the component can be easily positioned, inserted without bending leads
and solder quality can result then the following method may be used.
After the component is sufficiently removed and with the component leads fluxed and possibly preheated,
the replacement component is inserted with solder flowing.
The cycle is stopped by the footswitch after sufficient reflow or carrier may be raised to enhance solder
peeling.