AcroPack Series XMCAP2022
XMC Carrier Board
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BOARD CONFIGURATION
Power should be removed from the board when changing switch
configurations or when installing AcroPack modules, cables and field wiring.
Figure 1 XMCAP2022 Primary Side
Refer to the specifications for loading and power requirements. Be sure that
the system power supplies are able to accommodate the power requirements
of the carrier board, plus the installed AcroPack modules within the voltage
tolerances specified.
IMPORTANT: Adequate thermos conduction must be provided to prevent a temperature rise above the
maximum operating temperature.
The lack of thermo conduction from the XMC carrier could be a cause for
some concern. Adequate thermo conduction must be provided to prevent a
temperature rise above the maximum operating temperature and to prolong
the life of the electronics.
