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AcroPack Series XMCAP2022

XMC Carrier Board

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Ordering Information

The XMCAP2022-LF was designed for use in the ARCX4000 series. It is the
same as the XMCAP2021-LF but with different routing to the Rear I/O
connectors P14 and P16.

Model

I/O Type

XMCAP2022-LF

Rear (P14 & P16) For

ARCX4000

applications

KEY XMCAP2022 FEATURES

Interface for AcroPack modules

–

The XMCAP2022 provides an electrical and

mechanical interface for up to two industry standard mini-PCIe or AcroPack
modules. AcroPack modules are available from Acromag. Mini-PCIe cards are
available from other vendors in a wide variety of input/output configurations
to meet the needs of varied applications.

PCI Express

Version 2.1 Compliant Carrier: -

Includes a PCIe switch to allow

two PCIe devices (AcroPack or mini-PCIe) to share a single XMC slot on the
XMC carrier.

Board Identification

–

A unique carrier and site number can be set for each

AcroPack site automatically by geographical address bits or by DIP switch. This
feature provides the capability to distinguish a particular AcroPack module
from others when multiple instances of the same module are used in a
system.

JTAG Programming Header

–

JTAG programming is supported both through

the XMC P15 connector, as well as through a Molex 78171-5006 6-pin micro
connector (J3). This connection is provided for programming and debugging
the FPGA on some AcroPack modules. The JTAG ports of the two AcroPack
modules are daisy-chained.

SIGNAL INTERFACE PRODUCTS

This AcroPack carrier board will mate directly to most industry standard mini-
PCIe and AcroPack modules. Acromag provides the following interface
products (all connections to field signals are made through the carrier board
which passes them to the individual AcroPack modules):

JTAG Adapter Cable

Model 5028-564 JTAG Adapter Cable connects between J3 and a Xilinx USB
programmer. This cable is only required if JTAG is not available on the XMC
carrier through the P15 XMC connector.

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Содержание XMCAP2022

Страница 1: ...For ARCX Applications USER S MANUAL ACROMAG INCORPORATED 30765 South Wixom Road Wixom MI 48393 2417 U S A Tel 248 295 0310 Copyright 2019 Acromag Inc Printed in the USA Data and specifications are sub...

Страница 2: ...8 ACROPACK HEATSINKING 8 ACROPACK MODULE INSTALLATION 9 FIELD GROUNDING CONSIDERATIONS 10 CONNECTORS 10 Rear Field I O Connectors 10 AcroPack Field I O Connectors 11 ARCX 4000 Series Cross Reference...

Страница 3: ...R 27 PCIe BUS COMPLIANCE 28 ENVIRONMENTAL 28 EMC Compliance 28 Vibration and Shock Standard 28 Reliability Prediction 29 7 APPENDIX A 30 Heatsink Installation 30 8 APPENDIX B 31 XMCAP202x Module Insta...

Страница 4: ...hts reserved Acromag and Xembedded are registered trademarks of Acromag Incorporated All other trademarks registered trademarks trade names and service marks are the property of their respective owner...

Страница 5: ...mber can be set for each AcroPack site automatically by geographical address bits or by DIP switch This feature provides the capability to distinguish a particular AcroPack module from others when mul...

Страница 6: ...s unless the device is contained within its original manufacturer s packaging Be aware that failure to comply with these guidelines will void the Acromag Limited Warranty UNPACKING AND INSPECTION Upon...

Страница 7: ...er supplies are able to accommodate the power requirements of the carrier board plus the installed AcroPack modules within the voltage tolerances specified IMPORTANT Adequate thermos conduction must b...

Страница 8: ...o select address bits A3 and A4 Figure 1 shows the location of switch SW1 Set the switch state as shown in Table 1 below to assign a unique slot address to this carrier Table 1 Switch SW1 assignments...

Страница 9: ...at shown in the figure Next using a rocking motion while gently applying force to keep the edge of the board against the back of the carrier connector position the module such that the field I O conne...

Страница 10: ...hat could be used to interface to the AcroPack input output modules CONNECTORS The XMCAP2022 carrier uses two AcroPack module field I O connectors two mini PCIe connectors two field I O connectors rea...

Страница 11: ...eld I O Pin Assignments AcroPack A XMCAP2022 Rear I O Connection Site A P16 XMCAP2022 Rear I O Connection Site A P14 Carrier P1 P2 Samtec SS5 50 3 00 L D K TR Module Pin Number Field A I O Signal C3 2...

Страница 12: ...33 Field A I O 18 36 36 Reserved isolation 35 35 Reserved isolation F3 38 38 Field A I O 19 F2 37 37 Field A I O 20 40 40 Reserved isolation 39 39 Reserved isolation F11 42 42 Field A I O 21 F10 41 41...

Страница 13: ...70 Field A I O 35 C14 69 69 Field A I O 36 72 72 Reserved isolation 71 71 Reserved isolation F15 74 74 Field A I O 37 F14 73 73 Field A I O 38 76 76 Reserved isolation 75 75 Reserved isolation 59 78...

Страница 14: ...nnection Site B P14 Carrier P1 P2 Samtec SS5 50 3 00 L D K TR Module Pin Number Field B I O Signal 1 2 2 Field B I O 1 3 1 1 Field B I O 2 4 4 Reserved isolation 3 3 Reserved isolation 2 6 6 Field B I...

Страница 15: ...19 33 33 Field B I O 18 36 36 Reserved isolation 35 35 Reserved isolation 18 38 38 Field B I O 19 20 37 37 Field B I O 20 40 40 Reserved isolation 39 39 Reserved isolation 21 42 42 Field B I O 21 23 4...

Страница 16: ...34 70 70 Field B I O 35 36 69 69 Field B I O 36 72 72 Reserved isolation 71 71 Reserved isolation 37 74 74 Field B I O 37 39 73 73 Field B I O 38 76 76 Reserved isolation 75 75 Reserved isolation 38...

Страница 17: ...Table below is a cross reference for the ARCX box connections Pin 38999 J3 J5 Pin PMC J14 J24 Pin XMC J16 J26 XMCAP2022 Signal Name 1 1 Field B I O 1 2 3 Field B I O 2 3 2 Field B I O 3 4 4 Field B I...

Страница 18: ...29 35 31 Field B I O 30 36N A N A 37 30 Field B I O 31 38 32 Field B I O 32 39N A N A 40N A N A 41 33 Field B I O 33 42 35 Field B I O 34 43 34 Field B I O 35 44 36 Field B I O 36 45N A N A 46N A N A...

Страница 19: ...73 59 Field A I O 39 74N A N A 75 58 Field A I O 33 76 60 Field A I O 34 77N A N A 78 61 Field A I O 48 79 63 Field A I O 47 80N A N A 81 62 Field A I O 25 82 64 Field A I O 26 83N A N A 84 C19 Field...

Страница 20: ...C8 Field A I O 18 110 N A N A 111 F9 Field A I O 24 112 F8 Field A I O 23 113 N A N A 114 C7 Field A I O 13 115 C6 Field A I O 14 116 N A N A 117 F7 Field A I O 7 118 F6 Field A I O 8 119 N A N A 120...

Страница 21: ...2 N C LED_WWAN 1 39 3 3V4 40 GND 37 GND 38 N C USB_D 1 35 GND 36 N C USB_D 1 33 PETX0_P 34 GND 31 PETX0_N 32 SMB_DATA5 29 GND 30 SMB_CLK5 27 GND 28 1 5V 25 PERX0_P 26 GND 23 PERX0_N 24 3 3V4 21 GND 22...

Страница 22: ...nnect No Connect No Connect No Connect No Connect VPWR 10 GND GND TDO GND GND GA0 11 No Connect No Connect No Connect No Connect No Connect VPWR 12 GND GND GA1 GND GND GND 13 No Connect No Connect 3 3...

Страница 23: ...when accessing the FPGAs on the AcroPack modules Table 1 JTAG Programming Debug Connector J3 Pin Assignment Signal Pin TDI 1 TDO 2 GND 3 TCK 4 TMS 5 VREF 3 3V 6 Notes TMS JTAG Test Mode Select This pi...

Страница 24: ...port to two ports one for each AcroPack site The host port consists of four PCIe lanes each of the AcroPack sites have one lane each Important Note The XMCAP2022 board is not hot swappable DC DC CONV...

Страница 25: ...with a Xilinx Platform USB II programming device A bypass circuit is included that will detect a vacant AcroPack site and close a switch to complete the JTAG chain The slot address CPLD is included f...

Страница 26: ...followed Also refer to the documentation of your carrier board to verify that it is correctly configured Verify that there are no blown fuses Replacement of the carrier and or AcroPack with one that...

Страница 27: ...G 6 pin micro connector Molex 78171 5006 POWER Board power requirements are a function of the installed AcroPack modules The current specified below is for the XMCAP2022 carrier board only 3 3 Volts 5...

Страница 28: ...re 55 to 125 C EMC Compliance The XMCAP2022 is designed to comply with EMC Directive 2004 108 EC Immunity per EN 61000 6 2 Electrostatic Discharge Immunity ESD per IEC 61000 4 2 Radiated Field Immunit...

Страница 29: ...ediction MTBF Mean Time Between Failure MTBF in hours using MIL HDBK 217F FN2 Per MIL HDBK 217 Ground Benign Controlled GBGC Temperature MTBF Hours MTBF Years Failure Rate FIT1 25 C 1 676 654 191 4 59...

Страница 30: ...eneric XMC heatsink and install a custom XMCAP202x heatsink 1 Refer to the ARCX box disassembly instructions found in the ARCX box manual to remove the assembly from its enclosure 2 Remove the XCOM 64...

Страница 31: ...sink 4 Install the custom heatsink as shown using the 4 screws provided 8 APPENDIX B XMCAP202x Module Installation The following instructions describe how to install an XMCAP202x into an ARCX box It i...

Страница 32: ...n below these standoffs should already be installed on the ARCX carrier board 2 Install the XMCAP202x on the carrier as shown below using the 4 screws provided 3 Installation is complete Refer to the...

Страница 33: ...d Yes No Non Volatile Memory Does this product contain Non Volatile memory i e Memory of whose contents is retained when power is removed Yes No Type EEPROM FLASH etc Size User Modifiable Function Pro...

Страница 34: ...UN 2018 ENZ Prelim AcroPack A pinout revised 31 JUL 2018 ENZ Prelim pinout to 38999 revised board configuration drawing updated and block diagram added 3 JAN 2019 A ENZ ARP Added heatsink information...

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