AcroPack Series XMCAP2022
XMC Carrier Board
- 4 -
1.
GENERAL INFORMATION
Intended Audience
This users’ manual was written for technically qualified personnel who will be
working with I/O devices using the AcroPack module.
Preface
The information contained in this manual is subject to change without notice,
and Acromag, Inc. (Acromag) does not guarantee its accuracy. Acromag
makes no warranty of any kind with regard to this material, including, but not
limited to, the implied warranties of merchantability and fitness for a
particular purpose. Further, Acromag assumes no responsibility for any errors
that may appear in this manual and makes no commitment to update, or keep
current, the information contained in this manual. No part of this manual may
be copied or reproduced in any form, without the prior written consent of
Acromag.
Trademark, Trade Name and Copyright Information
© 2018 by Acromag Incorporated.
All rights reserved. Acromag and Xembedded are registered trademarks of
Acromag Incorporated. All other trademarks, registered trademarks, trade
names, and service marks are the property of their respective owners.
Environmental Protection Statement
This product has been manufactured to satisfy environmental protection
requirements where possible. Many components used (structural parts,
circuit boards, connectors, etc.) are capable of being recycled. Final
disposition of this product after its service life must be conducted in
accordance with applicable country, state, or local laws or regulations.
XMCAP2022 OVERVIEW
The XMCAP2022 is a carrier for mini-PCIe or AcroPack mezzanine modules in
an XMC form factor. This carrier board provides a modular approach to
system assembly, since each carrier can be populated with any combination
of analog input/output, digital input/output, communication, etc. AcroPack
modules. Thus, the user can create a board which is customized to the
application. This saves money and space - a single carrier board populated
with AcroPack modules may replace several dedicated function XMC modules.