UM008 FMC204 User Manual
r1.14
UM008
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6.3 Cooling
Two different types of cooling are available for the FMC204.
6.3.1 Convection cooling
The air flow provided by the fans of the chassis the FMC204 is enclosed in will dissipate the
heat generated by the on board components. A minimum airflow of 300 LFM is
recommended.
Optionally, low profile FANs can be glued on top of the D/A devices. The card has a FAN
power connection that can be switched on and off under carrier card control (individually
driven from the CPLD).
For standalone operations (such as on a Xilinx development kit), it is highly recommended to
blow air across the FMC to ensure that the temperature of the devices is within the allowed
range. 4DSP’s warranty does not cover boards on which the maximum allowed temperature
has been exceeded.
6.3.2 Conduction cooling
In demanding environments, the ambient temperature inside a chassis could be close to the
operating temperature defined in this document. It is very likely that in these conditions the
junction temperature of power consuming devices will exceed the operating conditions
recommended by the device manufacturers (85
°
C).
The FMC204 is designed for maximum heat transfer to conduction-cooled ribs. A customized
cooling frame that connects directly to the surface of the D/A devices is allowed. This
conduction-cooling mechanism should be applied in combination with proper chassis air flow.
Contact 4DSP for detailed mechanical information.
7
Safety
This module presents no hazard to the user.
8
EMC
This module is designed to operate within an enclosed host system built to provide EMC
shielding. Operation within the EU EMC guidelines is not guaranteed unless it is installed
within an adequate host system. This module is protected from damage by fast voltage
transients originating from outside the host system which may be introduced through the
system.
