ZTEWelink MF206A Hardware Development Manual Download Page 11

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Hardware Development Guide of Module Product

MF206A

Figure 10–1 Recommended Pattern of Steel Mesh on Wielding panel

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Figure 10–2 Furnace Temperature Curve Reference Diagram

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Figure 10–3

The dimensions of Package tray

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Figure 10–4 Package process of modules

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Summary of Contents for MF206A

Page 1: ...Hardware Development Guide of Module Product Version 2 5 2015 06 18 MF206A ...

Page 2: ...ed trademark of ZTEWelink The name and logo of ZTEWelink are ZTEWelink s trademark or registered trademark Meanwhile ZTEWelink is granted to use ZTE Corporation s registered trademark The other products or company names mentioned in this document are the trademark or registered trademark of their respective owner Without the prior written permission of ZTEWelink or the third party oblige no one is...

Page 3: ... the chapter Chapter 5 1 Update the RF sourced index and source less index Chapter 6 1 Update the testing standard and testing environment Chapter 7 1 Add the chapter Chapter 8 1 Add the chapter 2 1 2013 03 26 1 Modify the logo of cover and page footer 2 Modify Legal Information 3 Modify some errors in the Table 2 2 of Working Frequency Band 4 Update the Table 1 1 of Supported Document List 5 Modi...

Page 4: ... Typical Application Circuit 8 Modify chapter 3 10 of Power on Power off Reset Signal 9 Update Figure 3 16 of Reference Circuit of Status Indicator 10 Modify chapter 4 2 of Working Current 11 Move the chapter 4 2 and 4 3 of Power on Power off Flow in the former document to chapter 3 10 12 Modify Index of RF under UMTS GPRS GSM EDGE Mode in chapter 5 1 and 5 2 13 Add the NOTE in chapter 6 3 14 Add ...

Page 5: ...Industrial Park Nanshan District Shenzhen P R China Web www ztewelink com Phone 86 755 26902600 E Mail ztewelink zte com cn Note Consult our website for up to date product descriptions documentation application notes firmware upgrades troubleshooting tips and press releases Besides ZTEWelink provides various technical support ways to the customers such as support by phone website instant messaging...

Page 6: ... 3 Function Overview 20 2 3 1 Baseband Function 20 2 3 2 Radio Frequency Function 21 3 Interfaces 23 3 1 Definition of PINs 23 3 1 1 Definition of PIN I O Parameters 23 3 1 2 PIN Configuration Diagram 23 3 1 3 PIN Description 25 3 2 Working Condition 29 3 3 Feature of Digital Power Level 30 3 4 Power Interface 30 3 4 1 Description of Power PINs 30 3 4 2 Requirement of Power Supply 30 3 5 U SIM Car...

Page 7: ...35 3 8 2 Electric Feature 35 3 9 I2C Bus 36 3 9 1 Description of PINs 36 3 9 2 Electric Feature 37 3 10 UART Interface 38 3 10 1 Description of PINs 38 3 10 2 Electric Feature 38 3 11 JTAG Joint Test Action Group Interface 39 3 11 1 Description of PINs 39 3 11 2 Application of JTAG Interface 40 3 12 Power on Power off Reset Signal 40 3 12 1 Description of PINs 40 3 12 2 Power on Power off Flow 42 ...

Page 8: ...F Cable and RF Connector 53 5 2 1 RF Connector 53 5 2 2 RF Cable 56 5 3 Design of Antenna 57 5 3 1 Preliminary Antenna Evaluation 57 5 3 2 Suggested Antenna Location 58 5 3 3 Suggested Antenna Occupancy Space 58 5 3 4 Matching Circuit of Antenna 58 5 3 5 Type of Antenna RF Cable RF Connector 59 5 4 Recommended Antenna Manufacturers 60 5 5 PCB line guidelines 60 5 6 Suggestions for EMC ESD Design 6...

Page 9: ...SM EDGE Mode 70 7 2 1 Output Transmission Power 70 7 2 2 Receiving Sensibility 71 7 2 3 Spurious Emission Index 71 8 Related Test Test Standard 72 8 1 Testing Reference 72 8 2 Description of Testing Environment 73 8 3 Reliability Testing Environment 74 8 4 Reliability Testing Result 75 9 Design Guide 77 9 1 General Design Rule Requirement 77 9 2 Suggestions for PCB Wielding Panel Design 77 9 3 Sug...

Page 10: ... Driving Circuit 41 Figure 3 11 Power on Sequence Chart of Module 42 Figure 3 12 Power off Sequence Chart of Module 43 Figure 3 13 Module Resetting Flow 44 Figure 3 14 Timing of Resetting Module 44 Figure 3 16 Reference Circuit of Status Indicator 46 Figure 4 1 Power Supply Current and Voltage Change under EDGE GPRS 48 Figure 4 2 Add storage capacitor to Module power supply terminal 49 Figure 4 3 ...

Page 11: ...preading abroad without Permission of ZTEWelink X MF206A Figure 10 1 Recommended Pattern of Steel Mesh on Wielding panel 80 Figure 10 2 Furnace Temperature Curve Reference Diagram 82 Figure 10 3 The dimensions of Package tray 83 Figure 10 4 Package process of modules 84 ...

Page 12: ...ignal 35 Table 3 9 Definition of UART Signal 38 Table 3 10 Definition of JTAG Signal 39 Table 3 11 Power on Power off Time 43 Table 3 12 Interactive Application Interface 44 Table 3 13 Definition of LED PIN Signal 45 Table 3 14 Definition of Indicator Status 46 Table 5 1 The Cable Consumption 56 Table 5 2 Passive Indexes of Main Antennas on PAD Products 63 Table 5 3 ZTEWelink Indexes for Mobile Te...

Page 13: ...e of Receiving Sensitivity 71 Table 8 1 Testing Standard 72 Table 8 2 Testing Environment 73 Table 8 3 Testing Instrument Device 74 Table 8 4 Reliability Features 74 Table 8 5 Temperature Testing Result Under Windless Environment 75 Table 8 6 High Low temperature Running Storage Testing Result 75 Table 10 1 Curve Temperature Curve Parameter Setting 81 ...

Page 14: ...s document the user can successfully fulfill the application and development of wireless 3G Internet product or equipment Besides the product features and technical parameters this document also provides the product reliability tests and related testing standards service function implementation flow RF performance indexes and a guide on the design of user circuits to provide the user with a comple...

Page 15: ...s Table 1 2 is a list of abbreviations involved in this document as well as the English full names Table 1 2 Abbreviation List Abbreviations Full Name AP Another name of DTE BER Bit Error Rate DL Downlink DPCH Dedicated Physical Channel ESD Electro Static discharge ECT Electric Connector Technology CO LTD GPRS General Packet Radio Service GSM Global Standard for Mobile Communications I O Input out...

Page 16: ...ems security solutions routers wireless POS mobile computing devices PDAs tablet PC and so on The features of module are described as below 1 It can support UMTS 850 900 1900 2100MHz frequency band and GSM GPRS EDGE 850 900 1800 1900MHz frequency band 2 It can provide high speed data access service under the mobile environment 3 It provides the SPI interface I2C interface U SIM card interface 3 0V...

Page 17: ...nical strength and heat dissipation performance There are altogether 30 heat dissipation ground wielding panels evenly distributed at the bottom of PCB The dimensions of 108 pin LGA encapsulation are 26 36mm and the height is 2 5 0 2mm The location of PIN 1 is identified by the ground wielding panel with an inclination at the bottom and its angle orientates to the top welding panel of the correspo...

Page 18: ...sion of ZTEWelink 17 MF206A Top View 2 2 Technical Parameters The major features of module can be described from the aspects of mechanic feature base band radio frequency technical standard and environment feature Table 2 1 is a list of the major technical parameters and features supported by module ...

Page 19: ... firmware upgrade UART interface Used for AT command data transmission or Diag service And can be switch by the command of UART Maximum power consumption 2 2W note1 Power Supply The range of voltage supply is 3 4V 4 2V and the typical value is3 8V Working current note2 Peak current 2A 3 8V Average normal working current 500mA 3 8V Average normal working current without services 75mA Standby curren...

Page 20: ...Multi slot Class 12 WCDMA CS UL 64kbps DL 64kbps WCDMA PS UL 384kbps DL 384kbps HSDPA DL 3 6Mbps GPRS type Class B 3GPP protocol R99 R5 Other protocols Support embedded TCP UDP protocols Support PPP protocol Support the protocols PAP Password Authentication Protocol and CHAP Challenge Handshake Authentication Protocol usually used for PPP connections Operating system Windows XP SP2 and later Windo...

Page 21: ...orking current the peak current average normal working current average normal working current without services are all the maximum value measured under the maximum power consumption The standby current refers to the current under the SLEEP mode 3 NA means unrelated 4 Using the module beyond these conditions may result in permanent damage to the module 2 3 Function Overview 2 3 1 Baseband Function ...

Page 22: ...DC 2 3 2 Radio Frequency Function The radio frequency function of module can be viewed from the aspect of over the air wireless bearer network frequency band whether the receive diversity feature is supported and the GPS function 1 Support UMTS 850 900 1900 2100MHz 2 Support GSM EDGE GPRS 850 900 1800 1900 MHz 3 Support GPS AGPS The working frequency band of module is as shown in Table 2 2 Table 2...

Page 23: ...thout Permission of ZTEWelink 22 MF206A UMTS1900 1850 MHz 1910 MHz 1930 MHz 1990 MHz UMTS2100 1920 MHz 1980 MHz 2110 MHz 2170 MHz GSM850 824 MHz 849MHz 869 MHz 894 MHz GSM900 890 MHz 915MHz 935 MHz 960MHz GSM1800 1710 MHz 1785MHz 1805 MHz 1880MHz GSM1900 1850 MHz 1910MHz 1930 MHz 1990MHz ...

Page 24: ...able 3 1 Table 3 1 PIN Parameters PIN Attribute Description DI Digital Input Pin DO Digital Output Pin AI Analog Input Pin AO Analog Output Pin B Two way digital port CMOS input Z High resistance output P1 PIN group 1 the power supply voltage is VDD_P1 P2 PIN group 2 the power supply voltage is VDD_P2 PU PIN internal pull up PD PIN internal pull down 3 1 2 PIN Configuration Diagram The PIN sequenc...

Page 25: ...8 99 100 101 102 103 104 105 106 107 108 13 1 ANT_MAIN GND JTAG_RESOUT_N PON_RST_N POWER_ON AP_READY I2C_SCL I2C_SDA MODULE_READY AP_WAKEUP_MODULE MODULE _WAKEUP_AP GND NC GND NC NC NC SPI_CLK NC MODULE_POWERON LED_GREEN LED_RED LED_BLUE VPH_PWR VPH_PWR VPH_PWR VPH_PWR UART_CTS UART_RFR UART_TXD UART_RXD GND NC NC NC NC GND ADC GND SPI_CS_N SPI_DATA_MI_SO SPI_DATA_MO_SI USB_VBUS GND USB_DP USB_DM ...

Page 26: ... internally Active low 5 POWER_ON P1 DI Turn on off the module PU Pull up to 1 8V internally 6 AP_READY P1 DI Module queries AP sleep status 7 I2C_SCL P1 B I2C serial clock 8 I2C_SDA P1 B I2C serial data 9 MODULE_READY P1 DO AP queries Module sleep status 10 AP_WAKEUP_MOD ULE P1 DI AP wakes up Module Low power level wakeup To make the module standby the AP needs to raise up this low signal 11 MODU...

Page 27: ...a transmitting burst which typically rises to 2 0A 24 VPH_PWR 25 VPH_PWR 26 VPH_PWR 27 UART_CTS P1 DI HV UART clear to send signal 28 UART_RFR P1 DO UART ready for receive signal 29 UART_TXD P1 DO UART transmit data output 30 UART_RXD P1 DI UART receive data input 31 GND Ground 32 NC 33 NC 34 NC 35 NC 36 GND Ground 37 ADC AI Analog Digital converter input 38 GND Ground 39 SPI_CS_N P1 DO SPI interf...

Page 28: ... AO Power supply for USIM card 49 UIM_DATA P1 P2 B Data signal of USIM card 50 UIM_CLK P1 P2 DO Clock signal of USIM card 51 UIM_RST P1 P2 DO Reset signal of USIM card 52 UIM_DP P1 P2 AI AO Data plus line 53 UIM_DM P1 P2 AI AO Data minus line 54 GND Ground 55 VREG_SDCC P2 AO Power supply for SD card 56 SDCC_CMD P2 B SD card control signal HV 57 SDCC_CLK P2 DO SD card clock signal 58 SDCC_DATA3 P2 ...

Page 29: ...ND Ground 79 108 GND Heat dissipation welder NOTE NC indicates Not Connected internal That is there is no connection inside the module P1 and P2 refer to the power supply signal level group 1 and 2 If not used almost all pins should be left disconnected The only exceptions are the following pins as shown in the Table 3 3 below Table 3 3 Mandatory Pins of Module PIN Signal Definition Remark 1 ANT_M...

Page 30: ...input 0 2 2 V VDD_P1 Voltage of PIN group P1 1 65 1 8 1 95 V VDD_P2 Voltage of PIN group P2 2 7 2 85 3 V NOTE 1 The typical voltage refers to the default I O voltage of P1 and P2 PIN group It is required that the external input PIN provides this voltage 2 The voltage design of external circuit interfaces should match that of the module PINs 3 When VPH_PWR works within the voltage range it can reac...

Page 31: ...4 47 54 63 66 69 71 78 This is the power ground and signal ground of module which needs to be connected to the ground on the system board If the GND signal is not connected completely the performance of module will be affected Besides there are altogether 30 heat dissipation wielding panel with PIN No 79 108 3 4 2 Requirement of Power Supply The power supply is recommended to be within the range o...

Page 32: ... signal of USIM card 52 UIM_DP Data cable USIM card data signal applied on a large capacity SIM card 53 UIM_DM Data cable USIM card data signal applied on a large capacity SIM card 3 5 2 Electric Feature On the line close to the U SIM card console be sure to add the ESD circuit protection during the design To comply with the requirements of 3GPP TS 51 010 1 and EMC authentication it is recommended...

Page 33: ...rface of module is the storage card based on FLASH embedded with 4 bit and 1 bit SD controller supporting SD and Mini SD cards Its PIN signals are as shown in Table 3 7 Table 3 7 Definition of SD Card Signal Interface PIN No Pin Name Signal Definition Signal Description 61 SDCC_DATA0 SD card data cable PIN SD card data cable 60 SDCC_DATA1 SD card data cable PIN 59 SDCC_DATA2 SD card data cable PIN...

Page 34: ...onse two way the command can be sent from the host to a single card all cards the response is sent from a single card all cards to the host SDCC_DATA 3 0 Data cable two way default is 0 12 5MB sec 3 6 3 Application of SD Card Interface Figure 3 3 is the reference design diagram for the SD interface The detection of SD card adopts the polling mode of DATA3 signal cable to judge whether T card is in...

Page 35: ...een the two cables should be restricted within 1mm NOTE NOTE If the users of module need the wakeup and sleep function and your AP side connects with the module through USB interface the AP side needs to support USB suspend and resume to realize this function The differential impedance should be controlled within 90ohm It is recommended to connect to a high speed common mode echo filter on the USB...

Page 36: ... of PINs The definition of SPI interface signaling is defined as shown in Table 3 8 Table 3 8 Definition of SPI Signal PIN No Pin Name I O Type Signal Description 39 SPI_ CS_N O SPI segment 40 SPI_ CLK O SPI clock 41 SPI_MISO_DATA B Main input slave output 42 SPI_MOSI_DATA B Main input slave output 3 8 2 Electric Feature The SPI bus is configured as the master equipment and there are three modes f...

Page 37: ...f SPI is configured as the master equipment any transmission process will be stopped but it can enter the running mode when the waiting mode stops Figure 3 5 is the SPI bus sequence chart Figure 3 5 SPI Bus Sequence Chart 3 9 I2C Bus 3 9 1 Description of PINs I2C is the two wire bus for the communication between ICs which supports any IC process NMOS CMOS dual polarity The two signal wires serial ...

Page 38: ...ports any external equipment of any manufacturing technology 1 8V 3 It supports the external functions such as the image sensor micro controller FM radio chip LCD chip audio DAC and keyboard interface The I2C interface has two working modes with different transmission ratios standard mode with a speed as high as 100kbps high speed mode with a speed as high as 400kbps Figure 3 6 is the I2C referenc...

Page 39: ... 9 Definition of UART Signal PIN No Pin Name Signal Definition Signal Description 27 UART1_CTS UART clear to send signal UART power level is 1 8V 28 UART1_RFR UART ready for receive signal 29 UART1_TXD UART transmit data output 30 UART1_RXD UART receive data input NOTE If the users of module need the wakeup and sleep function and you AP side connects with the module through UART interface you need...

Page 40: ...iption of PINs The JTAG interface complies with the ANSI ICEEE Std 1149 1 1990 standard and the interface is defined as shown in Table 3 10 Table 3 10 Definition of JTAG Signal PIN No Pin Name I O Type Signal Description 3 JTAG_RESOUT_N DI LGA reset 72 JTAG_TRST_N DI PD JTAG reset 73 JTAG_RTCK DO JTAG return clock 74 JTAG_TCK DI PU JTAG clock input 75 JTAG_TDO Z JTAG test data output 76 JTAG_TDI D...

Page 41: ...ergencies such as downloading interruption 3 12 Power on Power off Reset Signal 3 12 1 Description of PINs To turn on the module the pad POWER_ON must be tied low for at least 0 05 seconds and then released To turn off the module the pad POWER_ON must be tied low for at least 5 seconds and then released A simple circuit to do it is as shown in the following Figure 3 9 NOTE The resistors R1 and R2 ...

Page 42: ...urn on the Module Using Driving Circuit 50ms Turn on pulse R2 R1 POWER_ON You can reset the module by driving the PON_RST_N to a low level voltage for more than 100ms and then releasing A simple circuit to do it is as shown in the following Figure 3 10 Figure 3 9 Resetting the Module Using Driving Circuit 100ms Reset pulse R2 R1 PON_RST_N ...

Page 43: ...lly the interval between it to the POWER_ON signal cannot be too short Refer to T2 parameter ZTEWelink recommends that VPH_PWR adopt the power off plan that does not disconnect the power supply 3 The power on startup time takes the lower level of POWER_ON as the starting point and POWER_ON needs to be released after being kept on the low PWL for a period 4 SUB_VBUS is the USB PHY power supply It i...

Page 44: ...R to Power on taking effect 1 1 5 second T3 The period that the Power on signal for power on operation is kept on the low PWL 0 05 0 1 second T4 The period that the Power on signal for power off operation is kept on the low PWL 4 5 second T5 From the releasing the Power on button for power off operation to the power off of VPH_PWR and USB_VBUS 1 2 second 3 12 3 Resetting Flow The PON_RST_N reset s...

Page 45: ...e 3 13 1 Description of PINs Table 3 12 mainly describes the interfaces interacting with the application processor including the following three types of interfaces querying wakeup and status indication Table 3 12 Interactive Application Interface PIN No Pin Name I O Type Signal Description 6 AP_READY DI Module querying AP sleep status 9 MODULE_READY DO AP querying Module sleep status 10 AP_WAKEUP...

Page 46: ...WL indicates the wakeup status AP_WAKEUP_MODULE After the module has entered the sleep status the AP server can wake up the module by the low PWL control if it s always on the low PWL the module cannot enter the sleep status After the AP server enters the high PWL the module enters the sleep status MODULE_WAKEUP_AP After the AP server has entered the sleep status the module can lower down this sig...

Page 47: ...agram The flashing of indicator is controlled by the switch of RF and the LED PIN indicates the control signal to the external The indicator status of network is as defined in Table 3 14 If the RF control is not needed the AP server can design the status of control indicator by itself Figure 3 14 Reference Circuit of Status Indicator Table 3 14 Definition of Indicator Status Indicator Status Modul...

Page 48: ...ontrol the supply range between 3 4V 4 2V strictly If the value above module voltage range it will lead the main chip burned while below module voltage range it will affect the RF circuit s work or cause shutdown and restart occurred For the design of high speed USB signal lines it requires to control the differential impedance at 90ohm The voltage design of external circuit interfaces should matc...

Page 49: ... generated on the ground and the supply and exceptions such as restart of the module may occur The peak current of ZTEWelink module under the GSM BURST mode is different due to the differences in actual network environments And its transient current under different powers will be various as well The greater the power is the greater the transient current is The network quality also directly affects...

Page 50: ...ity and to prevent the module from resetting and shutting down caused by voltage fluctuation Figure 4 2 Add storage capacitor to Module power supply terminal DC3 8V VDD_3V8 0 47uF 22uF 330uF 2200uF 330uF C1 C2 C3 C4 C5 C6 330uF Add storage capacitor to Module power supply terminal to ensure the system instantaneous power capacity 4 4 Recommended Power Reference Circuit Option one Use DC DC switchi...

Page 51: ... Place a tantalum capacitor of 330μ F at the input of the chip Place a 2200μ F capacitor or place several 330μ F tantalum capacitors in parallel This circuit fully meets the module power requirements If the user s PCB size is limited the output of buck chip can place three more 330μ F tantalum capacitors of which the total capacity is more than 1000μ F Figure 4 3 DC DC Switching Power Supply Vin 5...

Page 52: ...that the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier buffer or earphone amplifier The power supply input cables should be kept separate from noise sensitive lines such as microphone earphone RF cables The Bypass low ESR capacitor must be placed close to the ZTEWelink module power input pads or in the case the power s...

Page 53: ...nk module then this noise is not so disturbing and power supply layout design can be more forgiving The PCB traces to the ZTEWelink module and the Bypass capacitor must be wide enough to ensure no significant voltage drops occur when the 2 5A current peaks are absorbed This is for the same reason as previous point Try to keep this trace as short as possible The PCB traces connecting the Switching ...

Page 54: ...printed on a thin PCB board and IFA plus parasitic units or monopole plus parasitic units are used as the antenna type 2 For CPE products because most products of this type have a large size the available space for antennas is also relative large Thus this type of products usually adopts the mode of PC racks plus FPC antennas or PC racks plus bullet antennas IFA plus parasitic units or monopole pl...

Page 55: ...ace and Figure 5 2 is the Interface of Main Antenna and GPS Antenna Welding Pad Figure 5 3 shows the main antenna RF connector Currently ZTEWelink module adopts the ECT818000157 RF connector testing console from ECT Company Figure 5 1 Main Antenna RF Connector Interface Figure 5 2 Interface of Main Antenna and GPS Antenna Welding Pad ...

Page 56: ...the RF port and the antenna interface If the main antenna is accessed by the LGA wielding panel the RF main antenna wield pane of the module itself needs to be connected to the antenna interface on main board via the wield pane and micro stripline or stripline The micro stripline or stripline is designed according to the 50ohm impedance and the dual L model matching circuit is reserved RF interfac...

Page 57: ...a diameter of 1 37mm or 1 13mm are adopted It is recommended to select the RF coaxial cable with a diameter of 1 37mm because it has less consumption There are many manufacturers of RF cables such as GBE in Taiwan Shenyu and Yuanda in China mainland SUMITOMO and Shin Din in Japan All of these manufacturers provide RF cables of more than two specifications The following tables describe RF cables of...

Page 58: ...ule 5 3 Design of Antenna 5 3 1 Preliminary Antenna Evaluation The antenna is a sensitive device and its performance is greatly affected by external environments The radiation performance of the antenna is affected by the mainboard dimensions antenna position occupied space size of the antenna and the grounding of surrounding components of the antenna Besides the fixed assembly of the antenna the ...

Page 59: ...ineers during the 2D 3D estimation phase according to the specific product Antenna shall be installed also according to antenna manufacturer instructions 5 3 3 Suggested Antenna Occupancy Space For different product types because their frequency bands are different required occupation space of the antenna is also different For the specific antenna space it is critical to estimate it with antenna e...

Page 60: ...ht falls within the limited range the circuit transition between the RF port on the module and the antenna interface can be saved and the RF connected used by the RF cable of the antenna can be directly connected to the RF terminal of the module Figure 5 6 Transition Circuit Microstrip line or stripline with a natural impedance of 50 ohm Microstrip line or stripline with a natural impedance of 50 ...

Page 61: ...elines The users of ZTEWelink modules should do as the following guidelines in the process of RF PCB line design 1 Make sure that the transmission line s characteristic impedance is 50ohm 2 Keep line on the PCB as short as possible since the antenna line loss shall be less than around 0 3 dB 3 Line geometry should have uniform characteristics constant cross section avoid meanders and abrupt curves...

Page 62: ...dule from the mainboard PCB instead of installing the module on the ground of the mainboard If they cannot be separated the module should be far from modules and components that might generate EMI such as chip and memory power interface and data cable interface 2 Because the mainboard of PAD CPE and Internet laptops does not have a shielding cover as that of mobile terminals to shield most circuit...

Page 63: ...gn For the key input output signal interface such as the U SIM card signal interface the ESD device should be placed closely for protection Besides on the side of main board the user should reasonably design the structure and PCB layout guarantee that the metallic shielding shell is fully grounded so as to leave a smooth discharge channel for ESD 5 7 Antenna Indexes The module supports the AGPS GP...

Page 64: ...the terminal product However different products have different Active indexes and different carries have different requirements for Active indexes as well Thus antenna engineers RF engineers baseband engineers structure engineers and ID engineers should work together to estimate the performance of the board during the project preliminary phase according to the Active indexes There is no universal ...

Page 65: ...e system is mainly composed of test chamber high precision positioning system and its controller Windows based PC running test software and RF test instruments with automatic test program The main RF instruments are integrated RF test equipment Spectrum Analyzer Network Analyzer The radio equipments Relay Switch Unit and PC with automatic test software are communicated via GPIB interface Figure 5 ...

Page 66: ...ge of module is as shown in Table 6 2 to Table 6 4 The IDLE mode indicates the power consumption of the module when there is no service but the module is interactive with network The table also provides the working current range under GSM and WCMA mode when there is data service Table 6 2 Averaged standby DC power consumption Mode Bands Test value mA Remark WCDMA Band I IMT2100 2 3 Standby mode Ba...

Page 67: ...ere is no service But the module is interactiving with the network such as network registration and USB is active The above values are the average of some test samples Under different environments the testing results might be slightly different Take the actual situation as the reference Table 6 4 Averaged DC power consumption in working state Mode Bands Test value mA Remark UMTS Band I IMT2100 468...

Page 68: ...t is acquired under the maximum transmission power Under different environments the testing results might be slightly different Take the actual situation as the reference NOTE The above average current is acquired under the maximum transmission power Under different environments the testing results might be slightly different Take the actual situation as the reference ...

Page 69: ...MHz or WCDMA 900 MHz 0 6 dB Compensation for WCDMA 2100 MHz or WCDMA 1900 MHz 0 8 dB NOTE The compensation for different frequency bands relates to the cable and the test environment The instrument compensation needs to be set according to the actual cable conditions 7 1 Index of RF under UMTS Mode 7 1 1 UMTS WCDMA The RF index should be tested strictly in accordance with the related testing speci...

Page 70: ... Operating Band level 3GPP Protocol Claim dBm Test value UMTS850 Class 3 24dBm 1 3dBm 22 4dBm UMTS1900 Class 3 24dBm 1 3dBm 22 3dBm UMTS2100 Class 3 24dBm 1 3dBm 22 3dBm 7 1 4 Receiving Sensibility The receiving sensitivity is a key parameter that indicates the receiver performance of module The receiving sensitivity is the weakest signal that the module at the antenna port can receive At the same...

Page 71: ...Bm 30 MHz f 1000 MHz 100 kHz 36 dBm 1 GHz f 12 75 GHz 1 MHz 30 dBm 7 2 Index of RF under GPRS GSM EDGE Mode The RF indexes of GSM GPRS EDGE850 900 1800 1900 should satisfy the requirements of 3GPP TS 05 05 protocol 7 2 1 Output Transmission Power The maximum output transmission power of GSM850 900 1800 1900 GMSK 8PSK should comply with the requirements of 3GPP TS 05 05 4 1 protocol as shown in Tab...

Page 72: ...900 receiving sensibility is shown in the Table 7 5 Table 7 5 Reference Table of Receiving Sensitivity Operating Band Unit 3GPP Protocol Claim Test value GSM850 dBm 3 84 MHz 102dBm 108dBm GSM900 dBm 3 84 MHz 102dBm 108dBm GSM1800 dBm 3 84 MHz 102dBm 107dBm GSM1900 dBm 3 84 MHz 102dBm 107dBm 7 2 3 Spurious Emission Index The spurious emission index of GSM850 900 1800 1900 GMSK should comply with th...

Page 73: ...FH vibration broadband random and guidance IEC60068214 Environmental testing part 2 14 Test N change of temperature IEC60068229 Basic environmental testing procedures part2 Test EB and guidance IEC6006822 Environmental testing part2 2 Test B dry heat IEC6006821 Environment testing part2 1 Test A cold GB T 15844 2 MS telecommunication RF wireless phone set environment requirement experimental metho...

Page 74: ...e range the RF index basically complies with the 3GPP specifications and the quality of data communication is affected to a certain extent but its normal function is not affected The module has passed the EMC test Table 8 2 is the requirement for the testing environment and Table 8 3 lists out the instruments and devices that might be used during the test WARNING Table 6 2 lists the extreme workin...

Page 75: ...t high low temperature running high low temperature storage and temperature shock experiment test Refer to Table 8 4 for the specific parameters Table 8 4 Reliability Features Test Item Test Condition Test Standard Random vibration Frequency range 5 20Hz PSD 1 0m2 s3 Frequency range 20 200Hz 3dB oct 3 axis 1 hour for each axis IEC 68 2 6 Temperature shock Low temperature 40 C 2 C High temperature ...

Page 76: ...PP specifications 8 4 Reliability Testing Result Table 8 5 Temperature Testing Result Under Windless Environment Mode Temperature Voltage Transmission Power Duration Testing Result GPRS Class 10 25 3 8 10 V Max 1hour Pass EDGE Class 12 25 3 8 10 V Max 1 hour Pass WCDMA 25 3 8 10 V Max 1 hour Pass Table 8 6 High Low temperature Running Storage Testing Result Test Item Test Condition Standard Test C...

Page 77: ...ading abroad without Permission of ZTEWelink 76 MF206A Extreme high temperature working Refer to Table 8 4 RF test function test Pass Low temperature storage Refer to Table 8 4 RF test function test Pass High temperature storage Refer to Table 8 4 RF test function test Pass ...

Page 78: ... impedance from damaging the module The RF index of this product itself is good and the user needs to design the antenna circuit of the main board and make the corresponding impedance control Otherwise the RF index of the whole set will be affected 9 2 Suggestions for PCB Wielding Panel Design When the user is designing the encapsulation wielding panel on main board the 30 heat wielding panels in ...

Page 79: ...8 MF206A Figure 9 1 Recommended PCB Wielding Panel Design 9 3 Suggestions for Heat dissipation Design The module will dissipate heat during the working process and might also be affected by other high temperature devices The heat dissipation is taken into full consideration during the product design as 30 heat wielding ...

Page 80: ...ole set as well NOTE 1 Keep this product away from heat dissipation devices with high power to prevent the temperature of the module from being too high 2 Do not put the module close to the large heat dissipation devices such as CPU or bridge The high temperature will affect the RF performance 9 4 Recommended Product Upgrading Plan It s recommended to use the one click software upgrade tool to upg...

Page 81: ...h of thermal pad on the bottom of the module narrow the mouth of the steel mesh of the original size so as to reduce the risk of shortcut between the module thermal and the peripheral PINs This method is effective 2 It is recommended to design to the mouth of steel mesh on the thermal pad wielding panel to the lattice form Figure 10 1 shows the recommended pattern for the steel mesh Figure 10 1 Re...

Page 82: ...ices ineffective causing the quality to decrease and the maintenance difficulty to increase At the same keep the precise maximum temperature to be below 245 as certain materials such as the crystal might crack under the high temperature and won t vibrate any more so the product function is affected Refer to Table 10 1 for the detailed requirements setting of furnace temperature curve refer to Figu...

Page 83: ...r limit Upper limit Maximum temperature ascending slope target 2 0 Time distance 20 seconds Maximum temperature descending slope Time distance 20 seconds Preheat time 150200C Time of the reflow temperature or above271C Maximum temperature Time of the temperature above 230C Degree per second Degree per second Degree centigrade Seconds Seconds Seconds Unit Upper limit Preheat time 150200C Time of th...

Page 84: ... The modules are packaged on trays of 40 pieces each These trays can be used in SMT processes for pick place handling The dimensions tolerance of tray is between 1mm except the dimensions with in the Figure below and the unit of dimensions is mm Figure 10 3 The dimensions of Package tray The package process of modules is shown as the Figure below ...

Page 86: ...lities areas where the air contains chemicals or particles such as gasoline stations oil refineries etc make sure that wireless devices are turned off It s the responsibility of users to enforce other country regulations and the specific environment regulations And ZTEWelink does not take on any liability for customer failure to comply with these precautions Federal Communication Commission Interf...

Page 87: ...nce 20cm between the radiator your body This device is intended only for OEM integrators under the following conditions 1 The antenna must be installed such that 20 cm is maintained between the antenna and users and the maximum antenna gain allowed for use with this device is 5 dBi 2 The transmitter module may not be co located with any other transmitter or antenna As long as 2 conditions above ar...

Page 88: ...grantee s FCC ID can be used only when all FCC compliance requirements are met Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user s manual of the end product which integrates this module The end user manual shall include all required regulatory information warning as show in ...

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ZTEWelink MF206A, Hardware Development Manual

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